Package outline dimensions, Suggested pad layout, Mjd31cq – Diodes MJD31CQ User Manual
Page 6

MJD31CQ
Document number: DS37049 Rev. 1 - 2
6 of 7
March 2014
© Diodes Incorporated
MJD31CQ
Package Outline Dimensions
Suggested Pad Layout
Note:
For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between
device Terminals and PCB tracking.
TO252
Dim Min Max Typ
A
2.19 2.39 2.29
A1
0.00 0.13 0.08
A2
0.97 1.17 1.07
b
0.64 0.88 0.783
b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c2 0.45 0.58 0.531
D
6.00 6.20 6.10
D1
5.21
e
2.286
E
6.45 6.70 6.58
E1
4.32
H
9.40 10.41 9.91
L
1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0° 10°
All Dimensions in mm
Dimensions Value (in mm)
C
4.572
X
1.060
X1
5.632
Y
2.600
Y1
5.700
Y2
10.700
b 3
E
L 3
D
L 4
b 2 ︵2 x ︶
b ︵3 x ︶
e
c 2
A
7 ° ± 1 °
H
S e a t i n g P l a n e
A
1
G a u g e P l a n e
a
0
.
5
0
8
L
2 . 7 4 R E F
D 1
A 2
E 1
X 1
X
Y 2
Y 1
Y
C