Diodes MMDT4126 User Manual
Mmdt4126, Features, Mechanical data
MMDT4126
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
DS30160 Rev. 9 - 2
1 of 4
www.diodes.com
MMDT4126
© Diodes Incorporated
•
Epitaxial Planar Die Construction
•
Complementary NPN Type Available (MMDT4124)
•
Ideal for Medium Power Amplification and Switching
•
Ultra-Small Surface Mount Package
•
Lead Free/RoHS Compliant (Note 3)
•
"Green" Device (Note 4 and 5)
Mechanical Data
•
Case: SOT-363
•
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020C
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish annealed
over Alloy 42 leadframe).
•
Terminal Connections: See Diagram
•
Marking Information: K2B, See Page 3
•
Ordering & Date Code Information: See Page 3
•
Weight: 0.006 grams (approximate)
SOT-363
Dim
Min
Max
A
0.10
0.30
B
1.15
1.35
C
2.00
2.20
D
0.65 Nominal
F
0.30
0.40
H
1.80
2.20
J
—
0.10
K
0.90
1.00
L
0.25
0.40
M
0.10
0.25
α
0°
8°
All Dimens
mm
ions in
Maximum Ratings
@T
A
= 25°C unless otherwise specified
A
M
J
L
D
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
V
CBO
-25
V
Collector-Emitter Voltage
V
CEO
-25
V
Emitter-Base Voltage
V
EBO
-4.0
V
Collector Current – Continuous (Note 1)
I
C
-200
mA
Power Dissipation (Note 1,2)
P
d
200
mW
Thermal Resistance, Junction to Ambient (Note 1)
R
θJA
625
°C/W
Operating and Storage Temperature Range
T
j
, T
STG
-55 to +150
°C
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
B C
H
K
G
C
1
B
2
E
2
E
1
B
1
C
2
F