Mmbd4448hw, Maximum ratings, Thermal characteristics – Diodes MMBD4448HW User Manual
Page 2: Electrical characteristics

MMBD4448HW
Document number: DS30228 Rev. 8 - 2
2 of 4
February 2011
© Diodes Incorporated
MMBD4448HW
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Unit
Non-Repetitive Peak Reverse Voltage
V
RM
100 V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
80 V
RMS Reverse Voltage
V
R(RMS)
57 V
Forward Continuous Current (Note 5)
I
FM
500 mA
Average Rectified Output Current (Note 5)
I
O
250 mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0
μs
@ t = 1.0s
I
FSM
4.0
1.0
A
Thermal Characteristics
Characteristic Symbol
Value
Unit
Power Dissipation (Note 5)
P
D
200 mW
Thermal Resistance Junction to Ambient Air (Note 5)
R
θJA
625
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Min
Max
Unit
Test
Condition
Reverse Breakdown Voltage (Note 6)
V
(BR)R
80
⎯
V
I
R
= 2.5
μA
Forward Voltage
V
F
0.62
⎯
⎯
⎯
0.72
0.855
1.0
1.25
V
I
F
= 5.0mA
I
F
= 10mA
I
F
= 100mA
I
F
= 150mA
Peak Reverse Current (Note 6)
I
R
⎯
100
50
30
25
nA
μA
μA
nA
V
R
= 70V
V
R
= 75V, T
J
= 150
°C
V
R
= 25V, T
J
= 150
°C
V
R
= 20V
Total Capacitance
C
T
⎯
3.5 pF
V
R
= 6V, f = 1.0MHz
Reverse Recovery Time
t
rr
⎯
4.0 ns
V
R
= 6V, I
F
= 5mA
Notes:
5. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at
0
50
40
80
100
150
200
250
0
120
160
200
P
,
P
O
WE
R
DI
SSI
P
A
T
IO
N
(mW
)
D
T , AMBIENT TEMPERATURE ( C)
Fig. 1 Power Derating Curve (Note 5)
A
°
10
100
1,000
1
0.1
0
1.6
1.2
0.4
0.8
I,
I
N
S
T
AN
T
AN
E
O
U
S
F
O
R
WA
R
D
C
U
R
R
EN
T
(m
A
)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
F