Desd5v0s1bl new prod uc t, Maximum ratings, Thermal characteristics – Diodes DESD5V0S1BL User Manual
Page 2: Electrical characteristics

DESD5V0S1BL
Document number: DS31434 Rev. 4 - 2
2 of 4
March 2012
© Diodes Incorporated
DESD5V0S1BL
NEW PROD
UC
T
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Unit
Conditions
Peak Pulse Power Dissipation
P
PP
130 W
8/20
μs, Per Fig. 1
Peak Pulse Current
I
PP
12 A
8/20
μs, Per Fig. 1
ESD Protection – Contact Discharge
V
ESD_Contact
±30
kV
IEC 61000-4-2 Standard
ESD Protection – Air Discharge
V
ESD_Air
±30
kV
IEC 61000-4-2 Standard
Thermal Characteristics
Characteristic Symbol
Value
Unit
Package Power Dissipation (Note 5)
P
D
250 mW
Thermal Resistance, Junction to Ambient (Note 5)
R
θJA
500
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Conditions
Reverse Standoff Voltage
V
RWM
- - 5 V
-
Channel Leakage Current (Note 6)
I
RM
- 5
100
nA
V
RWM
= 5V
Clamping Voltage
V
CL
-
-
-
-
10
14
V
I
PP
= 1A, t
p
= 8/20μS
I
PP
= 12A, t
p
= 8/20μS
Breakdown Voltage
V
BR
5.5 - 9.5 V
I
R
= 1mA
Differential Resistance
R
DIF
-
0.4 - Ω
I
R
= 10A, t
p
= 8/20μS
Channel Input Capacitance
C
T
- 35 45 pF
V
R
= 0V, f = 1MHz
Notes:
5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
6. Short duration pulse test used to minimize self-heating effect.
0
t, TIME ( s)
Fig. 1 Pulse Waveform
μ
20
40
60
100
50
0
I
, PE
AK P
U
LS
E
CURRENT
(
%
I
)
Pp
p
P
20
25
30
35
0
1
2
3
4
5
6
V , REVERSE VOLTAGE (V)
Fig. 2 Typical Total Capacitance vs. Reverse Voltage
R
C
, T
O
TAL
C
A
P
A
C
IT
AN
C
E (
p
F
)
T
f = 1 MHz
