Electrical characteristics, Dmp3035sfg – Diodes DMP3035SFG User Manual
Page 3
POWERDI is a registered trademark of Diodes Incorporated
DMP3035SFG
Document number: DS35440 Rev. 3 - 2
3 of 7
May 2012
© Diodes Incorporated
DMP3035SFG
ADVAN
CE I
N
F
O
RM
ATI
O
N
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIMES (sec)
Fig. 3 Transient Thermal Resistance
0.001
0.01
0.1
r(t
),
T
R
ANS
IEN
T
T
H
E
R
MA
L
R
ESI
S
T
AN
C
E
1
R
(t) = r(t) * R
θ
θ
JA
JA
R
= 54°C/W
Duty Cycle, D = t1/ t2
θJA
D = 0.7
D = 0.9
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
Electrical Characteristics
T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
-30 - - V
V
GS
= 0V, I
D
= -250
μA
Zero Gate Voltage Drain Current
I
DSS
- -
-1.0
μA
V
DS
= -30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
- -
±100
nA
V
GS
= ±25V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
-1.0 -1.7 -2.5 V
V
DS
= V
GS
, I
D
= -250
μA
Static Drain-Source On-Resistance
R
DS (ON)
- 15 20
m
Ω
V
GS
= -10V, I
D
= -8A
- 21 29
V
GS
= -5V, I
D
= -5A
Forward Transfer Admittance
|Y
fs
|
- 22 - S
V
DS
= -5V, I
D
= -10.0A
Diode Forward Voltage
V
SD
- -0.74
-1.0 V
V
GS
= 0V, I
S
= -1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
- 1633 - pF
V
DS
= -15V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
- 459 - pF
Reverse Transfer Capacitance
C
rss
- 214 - pF
Gate Resistance
R
g
- 6.5 13
Ω
V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge V
GS
= -4.5V
Q
g
- 17 - nC
V
DS
= -15V, V
GS
= -10V, I
D
= 8A
Total Gate Charge V
GS
= -10V
Q
g
- 35.5 - nC
Gate-Source Charge
Q
gs
- 4.6 - nC
Gate-Drain Charge
Q
gd
- 5.7 - nC
Turn-On Delay Time
t
D(on)
- 8.5 - ns
V
GEN
= -10V, V
DD
= -15V,
R
GEN
= 3
Ω, I
D
= -15A
Turn-On Rise Time
t
r
- 14 - ns
Turn-Off Delay Time
t
D(off)
- 50 - ns
Turn-Off Fall Time
t
f
- 25.8 - ns
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.