Dmg7401sfg new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMG7401SFG User Manual
Page 2: Electrical characteristics, Dmg7401sfg

POWERDI is a registered trademark of Diodes Incorporated
DMG7401SFG
Document number: DS35623 Rev. 10 - 2
2 of 6
June 2013
© Diodes Incorporated
DMG7401SFG
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
-30 V
Gate-Source Voltage
V
GSS
±25 V
Continuous Drain Current (Note 6) V
GS
= -10V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-9.8
-7.7
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
-13.5
-10.8
A
Maximum Continuous Body Diode Forward Current (Note 5)
I
S
-3.0 A
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
I
DM
-80 A
Avalanche Current (Notes 7 & 8)
I
AR
14 A
Repetitive Avalanche Energy (Notes 7 & 8) L = 1mH
E
AR
104 mJ
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Total Power Dissipation (Note 5)
T
A
= +25°C
P
D
0.94
W
T
A
= +70°C
0.6
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
R
θJA
137 °C/W
t<10s 82
°C/W
Total Power Dissipation (Note 6)
T
A
= +25°C
P
D
2.2
W
T
A
= +70°C
1.3
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
R
θJA
60 °C/W
t<10s 36
°C/W
Thermal Resistance, Junction to Case (Note 6)
R
θJC
3.0 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BV
DSS
-30
—
— V
V
GS
= 0V, I
D
= -250
μA
Zero Gate Voltage Drain Current
I
DSS
—
—
-1
μA
V
DS
= -30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
—
—
±10
μA
V
GS
= ±20V, V
DS
= 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
V
GS(th)
-1.7 — -3.0 V
V
DS
= V
GS
, I
D
= -250
μA
Static Drain-Source On-Resistance
R
DS (ON)
—
9 11
m
Ω
V
GS
= -20V, I
D
= -12A
—
10 13
V
GS
= -10V, I
D
= -9A
—
17 25
V
GS
= -4.5V, I
D
= -5A
Forward Transfer Admittance
|Y
fs
|
—
21 — S
V
DS
= -5V, I
D
= -10A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
C
iss
—
2246 2987 pF
V
DS
= -15V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
—
352 468 pF
Reverse Transfer Capacitance
C
rss
—
294 391 pF
Gate resistance
R
g
—
5.1 8.5
Ω
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge (V
GS
= 4.5V)
Q
g
—
20.5 30 nC
V
DS
= -15V, I
D
= -12A
Total Gate Charge (V
GS
= 10V)
Q
g
—
41 58 nC
Gate-Source Charge
Q
gs
—
7.6 - nC
Gate-Drain Charge
Q
gd
—
8.0 - nC
Turn-On Delay Time
t
D(on)
—
11.3 23 ns
V
DD
= -15V, V
GS
= -10V,
R
L
= 1.25
Ω, R
G
= 3
Ω,
Turn-On Rise Time
t
r
—
15.4 31 ns
Turn-Off Delay Time
t
D(off)
—
38.0 61 ns
Turn-Off Fall Time
t
f
—
22.0 38 ns
BODY DIODE CHARACTERISTICS
Diode Forward Voltage
V
SD
—
-0.7 -1.0 V V
GS
= 0V, I
S
= -1A
Reverse Recovery Time (Note 9)
t
rr
—
20 31 ns
I
S
= -9.5A, dI/dt = 100A/
μs
Reverse Recovery Charge (Note 9)
Q
rr
—
9.5 18 nC
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. I
AR
and E
AR
rating are based on low frequency and duty cycles to keep T
J
= +25°C
8. Short duration pulse test used to minimize self-heating effect
9. Guaranteed by design. Not subject to product testing