Dmp2066lsd new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMP2066LSD User Manual
Page 2: Electrical characteristics, Dmp2066lsd

DMP2066LSD
Document number: DS31453 Rev. 4 - 2
2 of 5
January 2014
© Diodes Incorporated
DMP2066LSD
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
-20 V
Gate-Source Voltage
V
GSS
±12
V
Drain Current (Note 5) Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-5.8
-4.6
A
Pulsed Drain Current (Note 6)
I
DM
-20 A
Thermal Characteristics
Characteristic Symbol
Value
Unit
Total Power Dissipation (Note 5)
P
D
2.0 W
Thermal Resistance, Junction to Ambient (Note 5)
R
θJA
62.5 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Min
Typ
Max
Unit
Test
Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
-20
⎯
⎯
V
V
GS
= 0V, I
D
= -250µA
Zero Gate Voltage Drain Current
I
DSS
⎯
⎯
-1 µA
V
DS
= -20V, V
GS
= 0V
Gate-Source Leakage
I
GSS
⎯
⎯
±100
nA
V
GS
=
±12V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
-0.6 -0.94 -1.2 V
V
DS
= V
GS
, I
D
= -250µA
Static Drain-Source On-Resistance
R
DS (ON)
⎯
⎯
29
55
40
70
m
Ω
V
GS
= -4.5V, I
D
= -4.6A
V
GS
= -2.5V, I
D
= -3.8A
Forward Transconductance
g
fs
⎯
9
⎯
S
V
DS
= -10V, I
D
= -4.6A
Diode Forward Voltage (Note 7)
V
SD
-0.5 -0.72 -1.4 V
V
GS
= 0V, I
S
= -2.1A
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
⎯
820
⎯
pF
V
DS
= -15V, V
GS
= 0V
f = 1.0MHz
Output Capacitance
C
oss
⎯
200
⎯
pF
Reverse Transfer Capacitance
C
rss
⎯
160
⎯
pF
Gate Resistance
R
G
⎯
2.5
⎯
Ω
V
DS
= 0V, V
GS
= 0V
f = 1.0MHz
SWITCHING CHARACTERISTICS
Total Gate Charge
Q
G
⎯
10.1
⎯
nC
V
DS
= -10V, V
GS
= -4.5V,
I
D
= -5.9A
Gate-Source Charge
Q
GS
⎯
1.5
⎯
Gate-Drain Charge
Q
GD
⎯
4.3
⎯
Turn-On Delay Time
t
d(on)
⎯
4.4
⎯
ns
V
DS
= -10V, V
GS
= -4.5V,
I
D
= -1A, R
G
= 6.0
Ω
Rise Time
t
r
⎯
9.9
⎯
Turn-Off Delay Time
t
d(off)
⎯
28.0
⎯
Fall Time
t
f
⎯
23.4
⎯
Notes:
5. Device mounted on 2 oz. 1” x 1” Copper pads on 2” x 2” FR-4 PCB.
6. Pulse
width
≤10μS, Duty Cycle ≤1%.
7. Short duration pulse test used to minimize self-heating effect.