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Diodes DMN5L06DMK User Manual

Dmn5l06dmk new prod uc t, Features, Mechanical data

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DMN5L06DMK

Document number: DS30927 Rev. 4 - 2

1 of 4

www.diodes.com

September 2007

© Diodes Incorporated

DMN5L06DMK

NEW PROD

UC

T

DUAL N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR

Features

Dual N-Channel MOSFET

Low On-Resistance

Very Low Gate Threshold Voltage (1.0V max)

Low Input Capacitance

Fast Switching Speed

Low Input/Output Leakage

Small Surface Mount Package

Lead Free By Design/RoHS Compliant (Note 2)

ESD Protected up to 2kV

"Green" Device (Note 4)

Qualified to AEC-Q101 standards for High Reliability

Mechanical Data

Case: SOT-26

Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

Terminal Connections: See Diagram

Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208

Marking Information: See Page 4

Ordering Information: See Page 4

Weight: 0.015 grams (approximate)

S

1

D

1

D

2

S

2

G

1

G

2

SOT-26

ESD protected up 2kV

TOP VIEW

BOTTOM VIEW

Maximum Ratings

@T

A

= 25°C unless otherwise specified

Internal Schematic

TOP VIEW

Characteristic

Symbol

Value

Unit

Drain Source Voltage

V

DSS

50

V

Gate-Source Voltage

V

GSS

±20

V

Drain Current (Note 1)

Continuous

Pulsed (Note 3)

I

D

305
800

mA

Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Total Power Dissipation (Note 1)

P

D

400

mW

Thermal Resistance, Junction to Ambient

R

θJA

313

°C/W

Operating and Storage Temperature Range

T

j

, T

STG

-65 to +150

°C

Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage

BV

DSS

50

V

V

GS

= 0V, I

D

= 10

μA

Zero Gate Voltage Drain Current

@ T

C

= 25°C

I

DSS

60

nA

V

DS

= 50V, V

GS

= 0V

Gate-Body Leakage

I

GSS

1

500

50

μA
nA
nA

V

GS

= ±12V, V

DS

= 0V

V

GS

= ±10V, V

DS

= 0V

V

GS

= ±5V, V

DS

= 0V

ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage

V

GS(th)

0.49

1.0

V

V

DS

= V

GS

, I

D

= 250

μA

Static Drain-Source On-Resistance

R

DS (ON)





3.0
2.5
2.0

Ω

V

GS

= 1.8V, I

D

= 50mA

V

GS

= 2.5V, I

D

= 50mA

V

GS

= 5.0V, I

D

= 50mA

On-State Drain Current

I

D(ON)

0.5

1.4

A

V

GS

= 10V, V

DS

= 7.5V

Forward Transconductance

|Y

fs

|

200

mS

V

DS

=10V, I

D

= 0.2A

Source-Drain Diode Forward Voltage

V

SD

0.5

1.4 V

V

GS

= 0V, I

S

= 115mA

DYNAMIC CHARACTERISTICS
Input Capacitance

C

iss

50

pF

Output Capacitance

C

oss

25

pF

Reverse Transfer Capacitance

C

rss

5.0

pF

V

DS

= 25V, V

GS

= 0V

f = 1.0MHz

Notes:

1. Device mounted on FR-4 PCB.
2. No purposefully added lead.

3. Pulse width

≤10μS, Duty Cycle ≤1%.

4. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Short duration pulse test used to minimize self-heating effect.