Dmn4800lssl new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMN4800LSSL User Manual
Page 2: Electrical characteristics, Dmn4800lssl

DMN4800LSSL
Document number: DS35016 Rev. 4 - 2
2 of 6
November 2013
© Diodes Incorporated
DMN4800LSSL
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
30 V
Gate-Source Voltage
V
GSS
±20
V
Drain Current (Note 5) V
GS
= 10V Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
8.0
6.4
A
Drain Current (Note 5) V
GS
= 10V Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
6.7
5.3
A
Pulsed Drain Current (Note 6)
I
DM
50 A
Thermal Characteristics
Characteristic Symbol
Value
Unit
Total Power Dissipation (Note 5)
P
D
1.46 W
Thermal Resistance, Junction to Ambient
R
θJA
86 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Min
Typ
Max
Unit
Test
Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
30
⎯
⎯
V
V
GS
= 0V, I
D
= 250μA
Zero Gate Voltage Drain Current
I
DSS
⎯
⎯
1
μA
V
DS
= 30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
⎯
⎯
±100
nA
V
GS
=
±20V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
0.8 1.2
1.6 V
V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance
R
DS (ON)
⎯
11
14
14
20
mΩ
V
GS
= 10V, I
D
= 8A
V
GS
= 4.5V, I
D
= 7A
Forward Transconductance
g
fs
⎯
8
⎯
S
V
DS
= 10V, I
D
= 8A
Diode Forward Voltage (Note 7)
V
SD
⎯
0.72 0.94 V
V
GS
= 0V, I
S
= 1A
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
⎯
798
⎯
pF
V
DS
= 10V, V
GS
= 0V
f = 1.0MHz
Output Capacitance
C
oss
⎯
128
⎯
pF
Reverse Transfer Capacitance
C
rss
⎯
122
⎯
pF
Gate Resistance
R
G
⎯
1.37
⎯
Ω
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge
Q
g
⎯
8.7
⎯
nC
V
GS
= 5V, V
DS
= 15V, I
D
= 9A
Gate-Source Charge
Q
gs
⎯
1.7
⎯
Gate-Drain Charge
Q
gd
⎯
2.4
⎯
Turn-On Delay Time
t
d(on)
⎯
5.03
⎯
ns
V
DD
= 15V, V
GEN
= 10V,
R
L
= 15Ω
, R
G
= 6.0Ω
, I
D
= 1A
Rise Time
t
r
⎯
4.50
⎯
Turn-Off Delay Time
t
d(off)
⎯
26.33
⎯
Fall Time
t
f
⎯
8.55
⎯
Notes:
5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
6. Repetitive rating, pulse width limited by junction temperature.
7. Short duration pulse test used to minimize self-heating effect.