Diodes DMN4468LSS - Manual (Page 2)

DMN4468LSS
Document number: DS31773 Rev. 5 - 2
2 of 6
www.diodes.com
October 2013
© Diodes Incorporated
DMN4468LSS
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Drain-Source Voltage V DSS 30 V
Gate-Source Voltage V GSS ±20 V
Continuous Drain Current (Note 5)
Steady
State
T A = +25°C
T A = +70°C
I D
10
9
A
Pulsed Drain Current (10μs pulse, duty cycle = 1%) I DM 50 A
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) P
D
1.52 W
Thermal Resistance, Junction to Ambient (Note 5) R
JA
82 °C/W
Thermal Resistance, Junction to Case (Note 6) R
Jc
8.2 °C/W
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BV
DSS
30 — — V V
GS
= 0V, I
D
= 250μA
Zero Gate Voltage Drain Current T
J
= +25°C I
DSS
— — 1.0 μA V
DS
= 30V, V
GS
= 0V
Gate-Source Leakage I
GSS
— — ±100 nA V
GS
= ±20V, V
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
V
GS(th)
1.05 — 1.95 V V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance R
DS (ON)
—
11
15 14
20
mΩ
V
GS
= 10V, I
D
= 11.6A
V
GS
= 4.5V, I
D
= 10A
Forward Transfer Admittance |Y
fs
| — 8 — S V
DS
= 5V, I
D
= 11.6A
Diode Forward Voltage V
SD
— 0.73 0.95 V V
GS
= 0V, I
S
= 1A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
C
iss
— 867 — pF
V
DS
= 10V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance C
oss
— 85 — pF
Reverse Transfer Capacitance C
rss
— 81 — pF
Gate Resistance R
g
— 1.39 — Ω V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge Q
g
— 18.85 — nC
V
GS
= 10V, V
DS
= 15V,
I
D
=11.6A
Gate-Source Charge Q
gs
— 2.59 — nC
Gate-Drain Charge Q
gd
— 6.15 — nC
Turn-On Delay Time t
D(on)
— 5.46 — ns
V
DD
= 15V, V
GS
= 10V,
R
L
= 1.3Ω, R
G
= 3Ω, I
D
= 1A
Turn-On Rise Time t
r
— 14.53 — ns
Turn-Off Delay Time t
D(off)
— 18.84 — ns
Turn-Off Fall Time t
f
— 6.01 — ns
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.