Diodes DMN3300U - Manual (Page 2)

DMN3300U
Document number: DS31181 Rev. 5 - 2
2 of 5
www.diodes.com
September 2012
© Diodes Incorporated
DMN3300U
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
30 V
Gate-Source Voltage V
GSS
±12 V
Continuous Drain Current (Note 5) V
GS
= 4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
1.5
1.2
A
Continuous Drain Current (Note 6) V
GS
= 4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
2.0
1.6
A
Pulsed Drain Current (10µs pulse, duty cycle = 1%) I
DM
8 A
Maximum Body Diode Continuous Current (Note 6) I
S
1.6 A
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation
(Note 5)
P
D
0.7
W
(Note 6) 1.3
Thermal Resistance, Junction to Ambient
(Note 5)
R θJA
176
°C/W (Note 6) 102
Thermal Resistance, Junction to Case (Note 6) R θJC 45
Operating and Storage Temperature Range T J, T STG
-55 to +150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
30 37 ⎯ V V
GS
= 0V, I
D
= 100 μA
Zero Gate Voltage Drain Current I
DSS
⎯ ⎯ 1 μA V
DS
= 30V, V
GS
= 0V
Gate-Source Leakage I
GSS
⎯ ⎯ ±10 μA V
GS
= ±12V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
0.5 ⎯ 1 V V
DS
= V
GS
, I
D
= 250
μA
Static Drain-Source On-Resistance R
DS (ON)
⎯
100
140
185
240 150
200
250
300
m
Ω
V
GS
= 4.5V, I
D
= 4.5A
V
GS
= 2.5V, I
D
= 3.5A
V
GS
= 1.8V, I
D
= 1.5A
V
GS
= 1.5V, I
D
= 0.5A
Forward Transfer Admittance |Y
fs
| ⎯ 5 ⎯ S V
DS
=5V, I
D
= 2.4A
Diode Forward Voltage V SD
⎯ 0.8 1.1 V V
GS = 0V, I = 0.5A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
⎯ 193 ⎯ pF
V DS = 10V, V GS = 0V
f = 1.0MHz
Output Capacitance C
oss
⎯ 35 ⎯ pF
Reverse Transfer Capacitance C
rss
⎯
23
⎯
pF
Turn-On Delay Time t
d(on)
⎯ 7 ⎯
ns
V
DD
= 10V, R
L
= 10 Ω
I
D
= 1A, V
GEN
= 4.5V, R
G
= 6 Ω
Rise Time t r
⎯ 24 ⎯
Turn-Off Delay Time t
d(off)
⎯ 24 ⎯
Fall Time t
f
⎯ 12 ⎯
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout
7 .Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing