Diodes DMN3067LW - Manual (Page 2)

DMN3067LW
Document number: DS36640 Rev. 4 - 2
2 of 6
www.diodes.com
March 2014
© Diodes Incorporated
DMN3067LW
NEW PROD
UC
T
ADVANCED INFORMATION
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
30 V
Gate-Source Voltage V
GSS
±12 V
Continuous Drain Current (Note 6) V
GS
= 4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
2.6
2.1
A
Pulsed Drain Current (10µs pulse, duty cycle = 1%) I
DM
10 A
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation
(Note 5)
P
D
0.5
W
(Note 6) 1.1
Thermal Resistance, Junction to Ambient
(Note 5)
R
θJA
241
°C/W
(Note 6) 130
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
30   V V
GS
= 0V, I
D
= 250μA
Zero Gate Voltage Drain Current I
DSS
  1 µA V
DS
= 30V, V
GS
= 0V
Gate-Body Leakage I
GSS
  ±10 μA V
GS
= ±12V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
0.5  1.5 V V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance R
DS (ON)
 48 67
mΩ
V
GS
= 4.5V, I
D
= 2.5A
 50 70 V
GS
= 4.0V, I
D
= 2.5A
 70 98 V
GS
= 2.5V, I
D
= 2.5A
Diode Forward Voltage V
SD
  1.2  V V
GS
= 0V, I
S
= 0.6A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
 447 
pF V
DS
= 10V, V
GS
= 0V, f = 1.0MHz Output Capacitance C
oss
 54 
Reverse Transfer Capacitance C
rss
 41 
Gate Resistance R
G
 23  Ω V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge Q
g
 4.6 
nC
V
GS
= 4.5V, V
DS
= 15V,
I
D
= 2.5A
Gate-Source Charge Q
gs
 1.0 
Gate-Drain Charge Q
gd
 1.0 
Turn-On Delay Time t
D(on)
 3.8 
nS
V
DD
= 15V, I
D
= 1.25A, V
GEN
= 4.5V
,
R
GEN
= 10Ω
Turn-On Rise Time t
r
 5.2 
Turn-Off Delay Time t
D(off)
 15 
Turn-Off Fall Time t
f
 6.1 
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout
7 .Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.