Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMN3033LSD User Manual
Page 2: Dmn3033lsd

DMN3033LSD
Document number: DS31262 Rev. 9 - 2
2 of 6
February 2014
© Diodes Incorporated
DMN3033LSD
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
30 V
Gate-Source Voltage
V
GSS
20
V
Drain Current (Note 5) Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
6.9
5.8
A
Pulsed Drain Current (Note 6)
I
DM
30 A
Thermal Characteristics
Characteristic Symbol
Value
Unit
Total Power Dissipation (Note 5)
P
D
2 W
Thermal Resistance, Junction to Ambient
R
θJA
62.5 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Min
Typ
Max
Unit
Test
Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
30
V
V
GS
= 0V, I
D
= 250μA
Zero Gate Voltage Drain Current
I
DSS
100 nA
V
DS
= 30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
100
nA
V
GS
=
20V, V
DS
= 0V
1
μA
V
GS
=
25V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
1
2.1 V
V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance
R
DS (ON)
13
22
20
27
mΩ
V
GS
= 10V, I
D
= 6.9A
V
GS
= 4.5V, I
D
= 5A
Forward Transconductance
g
fs
7
S
V
DS
=5V, I
D
= 6.9A
Diode Forward Voltage (Note 7)
V
SD
0.5
1.2 V
V
GS
= 0V, I
S
= 1A
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
725
pF
V
DS
= 15V, V
GS
= 0V
f = 1MHz
Output Capacitance
C
oss
114
pF
Reverse Transfer Capacitance
C
rss
92
pF
Gate Resistance
R
G
0.89
Ω
V
GS
= 0V, V
DS
= 0V, f = 1MHz
SWITCHING CHARACTERISTICS
Total Gate Charge
Q
g
6.4
13
nC
V
GS
= 4.5V, V
DS
= 15V, I
D
=5A
V
GS
= 10V, V
DS
= 15V, I
D
= 6.9A
Gate-Source Charge
Q
gs
1.9
nC
V
GS
= 4.5V, V
DS
= 15V, I
D
= 6.9A
Gate-Drain Charge
Q
gd
3.2
nC
V
GS
= 4.5V, V
DS
= 15V, I
D
= 6.9A
Turn-On Delay Time
t
d(on)
11
ns
V
DD
= 15V, V
GS
= 10V,
R
D
= 1.8Ω, R
G
= 6Ω
Turn-On Rise Time
t
r
7
ns
Turn-Off Delay Time
t
d(off)
63
ns
Turn-Off Fall Time
t
f
30
ns
Notes:
5. Device mounted on 2 oz. Copper pads on FR-4 PCB with R
θJA
= 62.5°C/W
6. Pulse width
10μS, Duty Cycle 1%.
7. Short duration pulse test used to minimize self-heating effect.