Dmn2100udm new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMN2100UDM User Manual
Page 2: Electrical characteristics, Dmn2100udm
DMN2100UDM
Document number: DS31186 Rev. 5 - 2
2 of 6
May 2012
© Diodes Incorporated
DMN2100UDM
NEW PROD
UC
T
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
20 V
Gate-Source Voltage
V
GSS
±8 V
Continuous Drain Current (Note 6) V
GS
= 4.5V
Steady
State
T
A
= 25°C
T
A
= 70°C
I
D
4.0
3.1
A
t<10s
T
A
= 25°C
T
A
= 70°C
I
D
4.5
3.5
A
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
I
DM
13 A
Maximum Body Diode Continuous Current
I
S
1.5 A
Thermal Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Units
Total Power Dissipation (Note 5)
T
A
= 25°C
P
D
1
W
T
A
= 70°C
0.6
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
R
θJA
127
°C/W
t<10s 91
Total Power Dissipation (Note 6)
T
A
= 25°C
P
D
1.5
W
T
A
= 70°C
0.9
Thermal Resistance, Junction to Ambient (Note 6)
Steady state
R
θJA
85
°C/W
t<10s 63
Thermal Resistance, Junction to Case (Note 6)
R
θJC
3.1
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Min
Typ
Max
Unit
Test
Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
20
⎯
⎯
V
V
GS
= 0V, I
D
= 250
μA
Zero Gate Voltage Drain Current
I
DSS
⎯
⎯
1
μA
V
DS
= 20V, V
GS
= 0V
Gate-Source Leakage
I
GSS
⎯
⎯
±1
μA
V
GS
=
±8V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
0.6
⎯
1.0 V
V
DS
= V
GS
, I
D
= 250
μA
Static Drain-Source On-Resistance
R
DS (ON)
⎯
32 55
m
Ω
V
GS
= 4.5V, I
D
= 6A
⎯
43 70
V
GS
= 2.5V, I
D
= 4.0A
⎯
56 90
V
GS
= 1.8V, I
D
= 1.5A
⎯
80 130
V
GS
= 1.5V, I
D
= 1.0A
Forward Transfer Admittance
|Y
fs
|
⎯
8
⎯
S
V
DS
=10V, I
D
= 6A
Diode Forward Voltage
V
SD
⎯
0.7 1.1 V V
GS
= 0V, I
S
= 2A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
⎯
555
⎯
pF
V
DS
= 10V, V
GS
= 0V
f = 1.0MHz
Output Capacitance
C
oss
⎯
112
⎯
pF
Reverse Transfer Capacitance
C
rss
⎯
84
⎯
pF
Total Gate Charge
Q
g
⎯
8.8
⎯
nC
V
DS
= 10V, V
GS
= 4.5V,
I
D
= 6.5A
Gate-Source Charge
Q
gs
⎯
1.4
⎯
nC
Gate-Drain Charge
Q
gd
⎯
3
⎯
nC
Turn-On Delay Time
t
D(on)
⎯
53
⎯
ns
V
DS
= 10V, I
D
= 1.0A
V
GS
= 4.5V, R
G
= 6
Ω
Turn-On Rise Time
t
r
⎯
78
⎯
ns
Turn-Off Delay Time
t
D(off)
⎯
561
⎯
ns
Turn-Off Fall Time
t
f
⎯
234
⎯
ns
Notes:
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate
7. Short duration pulse test used to minimize self-heating effect
8. Guaranteed by design. Not subject to production testing