Diodes DDTB (LO-R1) U User Manual
Ddtb, Uddtb, Lo-r1)

DS30400 Rev. 6 - 2
1 of 3
www.diodes.com
DDTB (LO-R1) U
© Diodes Incorporated
DDTB
(LO-R1)
U
DDTB
(LO-R1)
U
PNP PRE-BIASED 500 mA SURFACE MOUNT TRANSISTOR
Features
•
Epitaxial Planar Die Construction
•
Complementary NPN Types Available (DDTD)
•
Built-In Biasing Resistors
•
Lead Free/RoHS Compliant (Note 2)
•
"Green" Device (Note 3 & 4)
Mechanical Data
N
E
W
ODOD
P P
R
U
C
T
T
R
U
C
•
Case: SOT-323
•
Case Material: Molded Plastic, "Green" Molding
Compound, Note 4. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020C
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Terminal Connections: See Diagram
•
Lead Free Plating (Matte Tin Finish annealed over Alloy
42 leadframe)
•
Marking Information: See Table Below & Page 3
•
Ordering Information: See Page 3
•
Weight: 0.006 grams (approximate)
P/N
R1 (NOM) R2 (NOM) Type Code
DDTB122LU
DDTB142JU
DDTB122TU
DDTB142TU
0.22K
Ω
0.47K
Ω
0.22K
Ω
0.47K
Ω
10K
Ω
10K
Ω
OPEN
OPEN
P75
P76
P77
P78
SOT-323
Dim
Min
Max
A
0.25
0.40
B
1.15
1.35
C
2.00
2.20
D
0.65 Nominal
E
0.30
0.40
G
1.20
1.40
H
1.80
2.20
J
0.0
0.10
K
0.90
1.00
L
0.25
0.40
M
0.10
0.18
α
0
°
8
°
All Dimensions in mm
A
M
J
L
E
D
C
B
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Supply Voltage, (3) to (2)
V
CC
-50
V
Input Voltage, (1) to (2)
DDTB122LU
DDTB142JU
V
IN
+5 to -6
+5 to -6
V
Input Voltage, (2) to (1)
DDTB122TU
DDTB142TU
V
EBO (MAX)
-5
V
Output Current All
I
C
-500
mA
Power Dissipation (Note 1)
P
d
200
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
R
θJA
625
°C/W
Operating and Storage Temperature Range
T
j
, T
STG
-55 to +150
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
Schematic and Pin Configuration
R1
OUT
B
C
E
R2
3
2
1
IN
GND(+)
H
K
G