Package outline dimensions, Suggested pad layout – Diodes DP0150BLP4 User Manual
Page 4

DP0150ALP4 / DP0150BLP4
Document number: DS31493 Rev. 5 - 2
4 of 5
December 2013
© Diodes Incorporated
DP0150ALP4 / DP0150BLP4
NEW PROD
UC
T
Package Outline Dimensions
Suggested Pad Layout
0.1
1
10
100
V , REVERSE VOLTAGE (V)
R
Fig. 7 Typical Capacitance Characteristics
0
1
10
100
C
A
P
A
C
IT
A
N
C
E (
p
F
)
C
ibo
C
obo
f = 1MHz
0
50
100
150
200
250
0
2
4
6
8
10
-I , COLLECTOR CURRENT (mA)
C
Fig. 8 Typical Gain-Bandwidth Product
vs. Collector Current
f,
G
AI
N
-B
A
N
DW
ID
T
H
P
R
O
D
U
C
T
(M
H
z)
T
V
= -6V
f = 30MHz
CE
X2-DFN1006-3
Dim
Min
Max Typ
A
0.40
A1
0
0.05 0.02
b1
0.10
0.20 0.15
b2
0.45
0.55 0.50
D
0.95
1.05 1.00
E
0.55
0.65 0.60
e
0.35
L1
0.20
0.30 0.25
L2
0.20
0.30 0.25
L3
0.40
All Dimensions in mm
Dimensions
Value (in mm)
Z
1.1
G1
0.3
G2
0.2
X
0.7
X1
0.25
Y
0.4
C
0.7
Y
C
G1
G2
X
X
1
Z
L 3
L 1
L 2
e
b 1 ︵2 X ︶
D
E
A
Z
b 2
A 1
S e a t i n g P l a n e
P i n # 1 I D