Diodes ES2G User Manual
Es2g, Features, Mechanical data
ES2G
Document number: DS30212 Rev. 8 - 2
1 of 4
September 2010
© Diodes Incorporated
ES2G
2.0A SURFACE MOUNT SUPER-FAST RECTIFIER
Features
•
Glass Passivated Die Construction
•
Super-Fast Recovery Time For High Efficiency
•
Surge Overload Rating to 50A Peak
•
Ideally Suited for Automated Assembly
•
Lead Free Finish/RoHS Compliant (Note 1)
•
Green Molding Compound (No Halogen and Antimony)
(Note 2)
Mechanical Data
• Case:
SMB
•
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
•
Polarity: Cathode Band or Cathode Notch
•
Marking Information: See Page 3
•
Ordering Information: See Page 3
•
Weight: 0.093 grams (approximate)
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 6)
V
RRM
V
RWM
V
R
400
V
RMS Reverse Voltage
V
R(RMS)
280
V
Average Rectified Output Current
@ T
T
= 110
°C
I
O
2.0
A
Non-Repetitive Peak Forward Surge Current8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I
FSM
50
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Typical Thermal Resistance, Junction to Terminal (Note 3)
R
θJT
20
°C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ I
F
= 2.0A
V
FM
1.25
V
Peak Reverse Current
@ T
A
= 25
°C
at Rated DC Blocking Voltage (Note 6) @ T
A
= 125
°C
I
RM
5.0
350
μA
Reverse Recovery Time (Note 5)
t
rr
35
ns
Typical Capacitance (Note 4)
C
T
25
pF
Notes:
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. Unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pads as heat sink.
4. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
5. Measured with I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A. See Figure 5.
6. Short duration pulse test used to minimize self-heating effect
Top View
Bottom View
Green