Diodes DFLU1400 - Manual (Page 2)

DFLU1400
Document number: DS30784 Rev. 3 - 2
2 of 5
www.diodes.com
June 2013
© Diodes Incorporated
DFLU1400
Maximum Ratings
(@T A = +25°C, unless otherwise specified.)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 9) V
RRM
V
RWM
V R
400 V
RMS Reverse Voltage V R(RMS)
280 V
Average Rectified Output Current I
O
1.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I FSM
30 A
Thermal Characteristics
Characteristic Symbol Typ Max Unit
Power Dissipation (Note 5) @T
A
= +25°C P
D
 1.0 W
Thermal Resistance Junction to Ambient (Note 5) @T
A
= +25°C R ΘJA 117  °C/W
Thermal Resistance Junction to Soldering Point (Note 7) R ΘJS
 6 °C/W
Operating and Storage Temperature Range T
j,
T
STG
-65 to +150 C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Maximum Forward Voltage Drop @I
F
= 1.0A V
FM
1.25 V
Peak Reverse Current @T
A
= +25
C
at Rated DC Blocking Voltage (Note 9) @T
A
= +100 C
I
RM
5.0
200
A
Maximum Reverse Recovery Time (Note 8) t
rr
25 ns
Typical Total Capacitance (f = 1MHz, V
R
= 4VDC) C
T
14 pF
Notes: 5. Device mounted on 1" x 1", Polymide PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.
6. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
7. Theoretical R
JS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
8. Measured with I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A. See figure 5.
9. Short duration pulse test used to minimize self-heating effect.
10. Device mounted on FR-4 PCB, 2oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf. (see page 2)