Diodes DFLS230 User Manual
Dfls230, Powerdi, 0a surface mount schottky barrier rectifier
e
3
DS30518 Rev. 2 - 1
1 of 3
DFLS230
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
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Diodes Incorporated
DFLS230
2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI
ä
123
B
A
A
C
E
L4
L
L1
E
H
D
L3
L2
L
Maximum Ratings
@ T
A
= 25
°C unless otherwise specified
·
Guard Ring Die Construction for
Transient Protection
·
Low Power Loss, High Efficiency
·
Patented Interlocking Clip Design for High Surge Current
Capacity
·
Low Forward Voltage Drop
·
Lead Free Finish, RoHS Compliant (Note 5)
·
"Green" Molding Compound (No Br, Sb)
Mechanical Data
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
30
V
RMS Reverse Voltage
V
R(RMS)
21
V
Average Forward Current @ T
T
= 120°C
I
F(AV)
2.0
A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
I
FSM
40
A
Power Dissipation (Note 1)
P
D
1.67
W
Power Dissipation (Note 2)
P
D
556
mW
Thermal Resistance Junction to Ambient (Note 1)
R
qJA
60
°C/W
Thermal Resistance Junction to Ambient (Note 2)
R
qJA
180
°C/W
Thermal Resistance Junction to Soldering (Note 3)
R
qJS
10
°C/W
Operating Temperature Range
T
j
-55 to +125
°C
Storage Temperature Range
T
STG
-55 to +150
°C
·
Case: PowerDI
ä
123
·
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
·
Moisture Sensitivity: Level 1 per J-STD-020C
·
Terminal Connections: Cathode Band
·
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
·
Marking & Type Code Information: See Last Page
·
Ordering Information: See Last Page
·
Weight: 0.01 grams (approximate)
Electrical Characteristics
@ T
A
= 25
°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 4)
V
(BR)R
30
¾
¾
V
I
R
= 1.5mA
Forward Voltage
V
F
¾
¾
0.36
0.4
0.42
0.49
V
I
F
= 1.0A
I
F
= 2.0A
Leakage Current (Note 4)
I
R
¾
0.15
1.0
mA
V
R
= 30V, T
A
= 25
°C
Total Capacitance
C
T
¾
75
¾
pF
V
R
= 10V, f = 1.0MHz
Features
Notes: 1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode. T
A
= 25
°C
2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads. T
A
= 25
°C
3. Theoretical R
qJS
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. Short duration pulse test to minimize self-heating effect.
5. RoHS revision 13.2.2003. High Temperature Solder Exemption Applied, see
PowerDI
ä
123
Dim
Min
Max
Typ
A
3.50
3.90
3.70
B
2.60
3.00
2.80
C
1.63
1.93
1.78
D
0.93
1.00
0.98
E
0.85
1.25
1.00
H
0.15
0.25
0.20
L
0.45
0.85
0.65
L1
—
—
1.35
L2
—
—
1.10
L3
—
—
0.20
L4
0.90
1.30
1.05
All Dimensions in mm