Diodes DFLS1200 User Manual
Dfls1200, Features, Mechanical data
DFLS1200
Document number: DS30628 Rev. 6 - 2
1 of 3
www.diodes.com
October 2008
© Diodes Incorporated
DFLS1200
PowerDI is a registered trademark of Diodes Incorporated.
1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER
PowerDI
®
123
Features
•
Guard Ring Die Construction for Transient Protection
•
Low Power Loss, High Efficiency
•
Patented Interlocking Clip Design for High Surge Current
Capacity
•
Lead Free Finish, RoHS Compliant (Note 4)
•
"Green" Molding Compound (No Br, Sb)
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case:
PowerDI
®
123
•
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminal Connections: Cathode Band
•
Terminals: Finish – Matte Tin annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
•
Marking Information: See Page 2
•
Ordering Information: See Page 2
•
Weight: 0.01 grams (approximate)
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
200
V
RMS Reverse Voltage
V
R(RMS)
141
V
Average Forward Current
I
F(AV)
1.0
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I
FSM
40
A
Thermal Characteristics
Characteristic
Symbol Typ
Max
Unit
Thermal Resistance Junction to Ambient (Note 1)
R
θJA
132
⎯
°C/W
Thermal Resistance Junction to Soldering Point (Note 2)
R
θJS
⎯
7
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +175
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 3)
V
(BR)R
200
⎯
⎯
V
I
R
= 8
μA
Forward Voltage
V
F
⎯
⎯
0.85
V
I
F
= 1.0A
Leakage Current (Note 3)
I
R
⎯
⎯
2
μA
V
R
= 200V, T
A
= 25
°C
Total Capacitance
C
T
⎯
23
⎯
pF
V
R
= 5VDC, f = 1MHz
Notes:
1. Part mounted on FR-4 board with 2 oz., minimum recommended copper pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf. T
A
= 25°C
2. Theoretical R
θJS
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
3. Short duration pulse test used to minimize self-heating effect.
4. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
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