Ap9050, New prod uc t absolute maximum ratings, Thermal resistance – Diodes AP9050 User Manual
Page 3: Recommended operating conditions

AP9050
PROTECTION INTERFACE for PMICs with
INTEGRATED OVP CONTROL
AP9050
Document number: DS35283 Rev. 1 - 2
3 of 9
March 2011
© Diodes Incorporated
NEW PROD
UC
T
Absolute Maximum Ratings
(Note 2, 3)
Symbol
Parameter
Rating
Unit
V
IN
Supply Voltage
−0.3 to 30
V
V
GS
Gate-to-Source Voltage
±12
V
I
Dpk
Drain Current, Peak (10µs pulse)
19
A
I
D
Drain Current, Continuous
(Note 4, Steady-State)
T
A
= 25ºC
T
A
= 85ºC
3.7
2.7
A
P
max
Total Power Dissipation @ T
A
= 25°C
(Note 3, 4)
750 mW
T
J
Junction Temperature Range
−40 to +125
°C
T
J
Non-operating Temperature Range
−55 to +150
°C
T
L
Maximum Lead Temperature for Soldering
Purposes
260 °C
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and
transporting these devices.
Notes:
2. Exceeding these ratings may damage the device.
3. Mounted on FR4 Board using 30 mm
2
, 2 oz Cu.
4. Dual die operation (equally
−heated).
Thermal Resistance
Symbol
Parameter
Rating
Unit
θ
JA
Junction to Ambient (Note 5)
132
°C/W
θ
JC
Junction to Case
13
°C/W
Note: 5. Test condition for DFN2020-6: Mounted on FR4 Board using 30 mm
2
, 2 oz Cu.
Recommended Operating Conditions
(Note 6)
Symbol
Parameter
Min
Max
Unit
V
IN
Supply Voltage
3
30 V
T
A
Operating Ambient Temperature Range
−40
+85 °C
Note: 6. The device function is not guaranteed outside of the recommended operating conditions.