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Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes 2N7002VC/VAC User Manual

Page 2

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2N7002VC/VAC

Document number: DS30639 Rev. 6 - 2

2 of 4

www.diodes.com

October 2011

© Diodes Incorporated

2N7002VC/VAC

NEW PROD

UC

T





Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

60 V

Drain-Gate Voltage R

GS

≤ 1.0MΩ

V

DGR

60 V

Gate-Source Voltage (Note 5)

Continuous

Pulsed

V

GSS

±20
±40

V

Drain Current (Note 5)

Continuous

I

D

280 mA

Drain Current (Note 5) Pulsed

I

DM

1.5 A




Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Total Power Dissipation

P

D

150 mW

Thermal Resistance, Junction to Ambient

R

θJA

833 °C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C




Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

60 70

V

V

GS

= 0V, I

D

= 10

μA

Zero Gate Voltage Drain Current

@ T

C

= 25°C

@ T

C

= 125°C

I

DSS

1.0

500

µA V

DS

= 60V,

V

GS

= 0V

Gate-Body Leakage

I

GSS

±100 nA V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTIC (Note 6)
Gate Threshold Voltage

V

GS(th)

1.0

2.5 V

V

DS

= V

GS

, I

D

= 250

μA

Static Drain-Source On-Resistance

R

DS (ON)



7.5

13.5

Ω

V

GS

= 5V, I

D

= 0.05A,

V

GS

= 10V, I

D

= 0.5A, T

j

= 125°C

On-State Drain Current

I

D(ON)

0.5 1.0

A

V

GS

= 10V,

V

DS

= 7.5V

Forward Transconductance

g

FS

80

mS V

DS

= 10V, I

D

= 0.2A

DYNAMIC CHARACTERISTICS
Input Capacitance

C

iss

50 pF

V

DS

= 25V, V

GS

= 0V, f = 1.0MHz

Output Capacitance

C

oss

25 pF

Reverse Transfer Capacitance

C

rss

5.0 pF

SWITCHING CHARACTERISTICS
Turn-On Delay Time

t

D(ON)

20 ns

V

DD

= 30V, I

D

= 0.2A, R

L

= 150

Ω,

V

GEN

= 10V, R

GEN

= 25

Ω

Turn-Off Delay Time

t

D(OFF)

20 ns

Notes:

5. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can
be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.