Diodes BAV70DW User Manual
Bav70dw, Features, Mechanical data
BAV70DW
SURFACE MOUNT SWITCHING DIODE ARRAY
Features
•
Fast Switching Speed
•
Ultra-Small Surface Mount Package
•
For General Purpose Switching Applications
•
High Conductance
•
Two “BAV70” Circuits In One Package
•
Lead Free/RoHS Compliant (Note 3)
•
"Green" Device (Note 4 and 5)
Mechanical Data
•
Case: SOT-363
•
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
•
Orientation: See Diagram
•
Marking Information: See Page 2
•
Ordering Information: See Page 2
•
Weight: 0.006 grams (approximate)
SOT-363
C
1
A
1
A
1
A
2
A
2
C
2
TOP VIEW
Internal Schematic
TOP VIEW
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Non-Repetitive Peak Reverse Voltage
V
RM
100
V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
75
V
RMS Reverse Voltage
V
R(RMS)
53
V
Forward Continuous Current (Note 1)
I
FM
300
mA
Average Rectified Output Current (Note 1)
I
O
150
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0
μs
@ t = 1.0s
I
FSM
2.0
1.0
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
P
D
200
mW
Thermal Resistance Junction to Ambient Air (Note 1)
R
θJA
625
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
V
(BR)R
75
⎯
V
I
F
= 2.5
μA
Forward Voltage
V
F
⎯
0.715
0.855
1.0
1.25
V
I
F
= 1.0mA
I
F
= 10mA
I
F
= 50mA
I
F
= 150mA
Reverse Current (Note 2)
I
R
⎯
2.5
50
30
25
μA
μA
μA
nA
V
R
= 75V
V
R
= 75V, T
J
= 150
°C
V
R
= 25V, T
J
= 150
°C
V
R
= 20V
Total Capacitance
C
T
⎯
2.0
pF
V
R
= 0, f = 1.0MHz
Reverse Recovery Time
t
rr
⎯
4.0
ns
I
F
= I
R
= 10mA,
I
rr
= 0.1 x I
R
, R
L
= 100
Ω
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
BAV70DW
Document number: DS30132 Rev. 11 - 2
1 of 3
www.diodes.com
April 2008
© Diodes Incorporated