Diodes BAS16V - Manual

BAS16V
DUAL SURFACE MOUNT SWITCHING DIODE
Features
• Fast Switching Speed
• Surface Mount Package Ideally Suited for Automatic Insertion
• For General Purpose Switching Applications
• High Conductance
• Lead Free By Design/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
Mechanical Data
• Case: SOT-563
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.003 grams (approximate)
SOT-563
BAS16V
Document number: DS30447 Rev. 5 - 2
1 of 3
www.diodes.com
November 2007
© Diodes Incorporated
C
1
NC A
2
C
2
A
1
NC
TOP VIEW BOTTOM VIEW
Internal Schematic
TOP VIEW
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage V
RM
100 V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage V
RRM
V
RWM
V
R
75 V
RMS Reverse Voltage V
R(RMS)
53 V
Forward Continuous Current (Note 1) I
FM
300 mA
Average Rectified Output Current (Note 1) I
O
200 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0 μs
@ t = 1.0s
I
FSM
2.0
1.0
A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) P
d
150 mW
Thermal Resistance Junction to Ambient Air (Note 1) R
θJA
833 °C/W
Operating and Storage Temperature Range T
j
, T
STG
-65 to +150 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 5) V
(BR)R
75 ⎯ V I
R
= 100 μA
Forward Voltage V
F
⎯
0.715
0.855
1.0
1.25
V
I
F
= 1.0mA
I
F
= 10mA
I
F
= 50mA
I
F
= 150mA
Leakage Current (Note 5) I
R
⎯
1.0
50
30
25
μA
μA
μA
nA V
R
= 75V
V
R
= 75V, T
j
= 150 °C
V
R
= 25V, T
j
= 150 °C
V
R
= 20V
Total Capacitance C
T
⎯ 2.0 pF V
R
= 0, f = 1.0MHz
Reverse Recovery Time t
rr
⎯ 4.0 ns
I
F
= I
R
= 10mA,
I
rr
= 0.1 x I
R
, R
L
= 100 Ω
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can
be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
5. Short duration pulse test used to minimize self-heating effect.