Diodes BAV99T User Manual
Features, Mechanical data, Maximum ratings

BAS16T, BAW56T,
BAV70T, BAV99T
Document number: DS30260 Rev. 10 - 2
1 of 3
March 2009
© Diodes Incorporated
BAS16T, BAW56T,
BAV70T, BAV99T
SURFACE MOUNT FAST SWITCHING DIODE
Features
•
Ultra-Small Surface Mount Package
•
Fast Switching Speed
•
For General Purpose Switching Applications
• High
Conductance
•
Lead Free/RoHS Compliant (Note 1)
•
"Green" Device (Note 3 and 4)
Mechanical Data
• Case:
SOT-523
•
Case Material - Molded Plastic. UL Flammability Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish)
•
Polarity: See Diagrams Below
•
Marking Information: See Diagrams Below & Page 2
•
Ordering Information: See Page 2
•
Weight: 0.002 grams (approximate)
TOP VIEW
BAS16T Marking: A2
BAW56T Marking: JD
BAV70T Marking: JJ
BAV99T Marking: JE
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
85
V
RMS Reverse Voltage
V
R(RMS)
60
V
Forward Continuous Current (Note 2)
Single Diode
Double
Diode
I
FM
155
75
mA
Repetitive Peak Forward Current
I
FRM
500
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0
μs
@ t = 1.0ms
@ t = 1.0s
I
FSM
4.0
1.0
0.5
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 2)
P
D
150
mW
Thermal Resistance Junction to Ambient (Note 2)
R
θJA
833
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 5)
V
(BR)R
85
⎯
⎯
V
I
R
= 100
μA
Forward Voltage
V
F
⎯
⎯
0.715
0.855
1.0
1.25
V
I
F
= 1.0mA
I
F
= 10mA
I
F
= 50mA
I
F
= 150mA
Leakage Current (Note 5)
I
R
⎯
⎯
2.0
100
60
30
μA
μA
μA
nA
V
R
= 75V
V
R
= 75V, T
J
= 150
°C
V
R
= 25V, T
J
= 150
°C
V
R
= 25V
Total Capacitance
C
T
⎯
1.5
⎯
pF
V
R
= 0, f = 1.0MHz
Reverse Recovery Time
t
rr
⎯
⎯
4.0
ns
I
F
= I
R
= 10mA,
I
rr
= 0.1 x I
R
, R
L
= 100
Ω
Notes: 1. No purposefully added lead.
2. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
5. Short duration pulse test used to minimize self-heating effect.
SOT-523