Diodes BAT40V User Manual
Bat40v, Features, Mechanical data
BAT40V
Document number: DS30533 Rev. 7 - 2
1 of 3
www.diodes.com
July 2008
© Diodes Incorporated
BAT40V
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
Features
•
Low Forward Voltage Drop
•
Fast Switching
•
Ultra-Small Surface Mount Package
•
PN Junction Guard Ring for Transient and ESD Protection
•
Lead Free by Design/RoHS Compliant (Note 1)
•
Qualified to AEC-Q101 Standards for High Reliability
•
"Green" Device (Notes 4 and 5)
Mechanical Data
•
Case: SOT-563, Molded Plastic
•
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminal Connections: See Diagram
•
Terminals: Finish – Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
•
Terminals: Lead Bearing Terminal Plating available.
•
Marking Information: See Page 2
•
Ordering Information: See Page 2
•
Weight: 0.003 grams (approximate)
C
1
A
1
NC
NC
C
2
A
2
Top View
Device Schematic
Bottom View
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
40
V
Forward Continuous Current (Note 2)
I
F
200
mA
Repetitive Peak Forward Current (Note 2)
I
FRM
350
mA
Forward Surge Current (Note 2) @ tp =10ms
I
FSM
750
mA
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 2)
P
D
150
mW
Thermal Resistance, Junction to Ambient Air (Note 2)
R
θJA
833
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +125
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 3)
V
(BR)R
40
⎯
⎯
V
I
R
= 100
μA
Forward Voltage
V
F
⎯
⎯
330
420
800
1000
mV
I
F
= 2.0mA
I
F
= 15mA
I
F
= 100mA
I
F
= 200mA
Reverse Leakage Current (Note 3)
I
R
⎯
⎯
500
nA
V
R
= 25V
Total Capacitance
C
T
⎯
⎯
10
pF
V
R
= 1.0V, f = 1.0MHz
Reverse Recovery Time
t
rr
⎯
⎯
5.0
ns
I
F
= 10mA through I
R
= 10mA
to I
R
= 1.0mA, R
L
= 100
Ω
Notes:
1. No purposefully added lead.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. T
A
= 25°C.
3. Short duration pulse test used to minimize self-heating effect.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.