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Diodes BAS70W /-04 /-05 /-06 User Manual

Features, Mechanical data, Maximum ratings

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BAS70W /-04 /-05 /-06


SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features

Low Turn-on Voltage

Fast Switching

PN Junction Guard Ring for Transient and ESD Protection

Ultra-Small Surface Mount Package

Lead Free/RoHS Compliant (Note 3)

"Green" Device (Note 4 and 5)

Mechanical Data

Case: SOT-323

Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Solderable per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).

Polarity: See Diagrams Below

Marking Information: See Page 2

Ordering Information: See Page 2

Weight: 0.006 grams (approximate)

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BAS70W BAS70W-04 BAS70W-05 BAS70W-06

Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

V

RRM

V

RWM

V

R

70

V

RMS Reverse Voltage

V

R(RMS)

49

V

Forward Continuous Current (Note 1)

I

F

70

mA

Non-Repetitive Peak Forward Surge Current

@ t

p

< 1.0s

I

FSM

100

mA

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 1)

P

D

200

mW

Thermal Resistance Junction to Ambient Air (Note 1)

R

θJA

625

°C/W

Operating Temperature Range

T

J

-55 to +125

°C

Storage Temperature Range

T

STG

-65 to +150

°C

Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Max

Unit

Test Condition

Reverse Breakdown Voltage (Note 2)

V

(BR)R

70

I

R

= 10

μA

Forward Voltage

V

F

410

1000

mV

t

p

<300µs, I

F

= 1.0mA

t

p

<300µs, I

F

= 15mA

Reverse Current (Note 2)

I

R

100

nA

t

p

< 300µs, V

R

= 50V

Total Capacitance

C

T

2.0

pF

V

R

= 0V, f = 1.0MHz

Reverse Recovery Time

t

rr

5.0

ns

I

F

= I

R

= 10mA to I

R

= 1.0mA,

I

rr

= 0.1 x I

R

, R

L

= 100

Ω

Notes:

1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which

can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.





BAS70W /-04 /-05 /-06

Document number: DS30113 Rev. 13 - 2

1 of 3

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July 2008

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