Diodes BAS70JW User Manual
Bas70jw, Features, Mechanical data
BAS70JW
Document number: DS30188 Rev. 13 - 2
1 of 3
www.diodes.com
June 2008
© Diodes Incorporated
BAS70JW
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
Features
•
Low Forward Voltage Drop
•
Fast Switching
•
Ultra-Small Surface Mount Package
•
PN Junction Guard Ring for Transient and ESD Protection
•
Lead Free/RoHS Compliant (Note 3)
•
"Green" Device (Note 4 and 5)
Mechanical Data
•
Case: SOT-363
•
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe). Please see Ordering Information, Note 7, on Page 2
•
Orientation: See Diagram
•
Marking Information: See Page 2
•
Ordering Information: See Page 2
•
Weight: 0.006 grams (approximate)
C
1
A
2
A
1
C
2
Top View
Device Schematic
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
70
V
RMS Reverse Voltage
V
R(RMS)
49
V
Forward Continuous Current (Note 1)
I
FM
70
mA
Non-Repetitive Peak Forward Surge Current
@ t < 1.0s
I
FSM
100
mA
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
P
D
200
mW
Thermal Resistance Junction to Ambient Air (Note 1)
R
θJA
625
°C/W
Operating Temperature Range
T
J
-55 to +125
°C
Storage Temperature Range
T
STG
-65 to +125
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
V
(BR)R
70
⎯
V
I
R
= 10
μA
Forward Voltage
V
F
⎯
410
1000
mV
mV
t
p
<300µs
,
I
F
= 1.0mA
t
p
<300µs
, I
F
= 15mA
Reverse Current (Note 2)
I
R
⎯
100
nA
t
p
< 300µs
,
V
R
= 50V
Total Capacitance
C
T
⎯
2.0
pF
V
R
= 0V
,
f = 1.0MHz
Reverse Recovery Time
t
rr
⎯
5.0
ns
I
F
=
I
R
=
10mA to
I
R
=
1.0mA,
I
rr
= 0.1 x
I
R
, R
L
= 100
Ω
Notes:
1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.