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Diodes 1N5711WS User Manual

Features, Mechanical data, Maximum ratings

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1N5711WS


SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features

Low Forward Voltage Drop

Guard Ring Construction for Transient Protection

Fast Switching Speed

Low Capacitance

Surface Mount Package Ideally Suited for Automated Insertion

Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)

Mechanical Data

Case: SOD-323

Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Solderable per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).

Polarity: Cathode Band

Marking Information: See Page 2

Ordering Information: See Page 2

Weight: 0.004 grams (approximate)







Top View

Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

V

RRM

V

RWM

V

R

70

V

RMS Reverse Voltage

V

R(RMS)

49

V

Forward Continuous Current

I

FM

15

mA

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 1)

P

D

150

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

R

θJA

650

°C/W

Operating Temperature Range

T

J

-55 to +125

°C

Storage Temperature Range

T

STG

-55 to +150

°C

Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Conditions

Reverse Breakdown Voltage (Note 2)

V

(BR)R

70

V

I

R

= 10

μA

Reverse Leakage Current (Note 2)

I

R

200

nA

V

R

= 50V

Forward Voltage Drop

V

F

0.41
1.00

V

I

F

= 1.0mA

I

F

= 15mA

Total Capacitance

C

T

2.0

pF

V

R

= 0V, f = 1.0MHz

Reverse Recovery Time

t

rr

1.0

ns

I

F

= I

R

= 5.0mA,

I

rr

= 0.1 x I

R

, R

L

= 100

Ω

Notes:

1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. Short duration pulse test used to minimize self-heating effect.

3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb

2

O

3

Fire Retardants.












1N5711WS

Document number: DS31033 Rev. 12 - 2

1 of 3

www.diodes.com

July 2008

© Diodes Incorporated

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