Diodes ZVN4310G - Manual (Page 2)

ZVN4310G
Document number: DS33372 Rev. 4 - 2
2 of 5
www.diodes.com
January 2012
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZVN4310G
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Drain-Source Voltage V DSS
100 V
Gate-Source Voltage V
GSS
±20 V
Continuous Drain Current I
D
1.67 A
Pulsed Drain Current (Note 3) I DM
12 A
Thermal Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Power Dissipation (Note 2) P
D
3 W
Thermal Resistance, Junction to Ambient (Note 2) R θJA 41.7 °C/W
Thermal Resistance, Junction to Leads (Note 4) R θJL 8.84 °C/W
Operating and Storage Temperature Range T
J , T
STG
-55 to +150 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
BV
DSS
100 - - V V
GS
= 0V, I
D
= 1mA
Zero Gate Voltage Drain Current T J = 25°C I DSS
- -
10
100
µA
µA V
DS
= 100V, V
GS
= 0V
V DS = 80V, V GS = 0V, T A = 125°C
Gate-Source Leakage I
GSS
- - ±20 nA V
GS
= ±20V, V
DS
= 0V
On-State Drain Current I
D(on)
9 - - A V
GS
= 10V, V
DS
= 10V
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
V
GS(th)
1 - 3 V V
DS
= V
GS
, I
D
= 1mA
Static Drain-Source On-Resistance R
DS (on)
-
0.4
0.5 0.54
0.75
Ω
V
GS
= 10V, I
D
= 3.3A
V
GS
= 5V, I
D
= 1.5A
Forward Transconductance g
fs
0.6 - - S V
DS
= 10V, I
D
= 3.3A
DYNAMIC CHARACTERISTICS (Note 5)
Input Capacitance
C iss
- - 350 pF
V
DS
= 25V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance C
oss
- - 140 pF
Reverse Transfer Capacitance C
rss
- - 20 pF
Turn-On Delay Time t
D(on)
- - 8 ns
V
DD
= 25V, I
D
= 3A, V
GEN
= 10V,
R
GS
= 50 Ω
Turn-On Rise Time t
r
- - 25 ns
Turn-Off Delay Time t
D(off)
- - 30 ns
Turn-Off Fall Time t
f
- - 16 ns
Notes: 2. For a device mounted on 50mm X 50mm X 1.6mm FR-4 PCB with high coverage of single sided 2oz copper, in still air condition.
3. Device mounted on minimum recommended pad layout test board, 10
μs pulse duty cycle = 1%.
4. Thermal resistance from junction to solder-point (at the end of the drain lead).
5. Short duration pulse test used to minimize self-heating effect.