Absolute maximum ratings, Thermal resistance, Zxmn2b14fh – Diodes ZXMN2B14FH User Manual
Page 2
ZXMN2B14FH
© Zetex Semiconductors plc 2007
Absolute maximum ratings
NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air
conditions.
(b) For a device surface mounted on FR4 PCB measured at t
Յ5 sec.
(c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300
s - pulse width limited by maximum junction
temperature.
Parameter
Symbol
Limit
Unit
Drain-source voltage
V
DSS
20
V
Gate-source voltage
V
GS
± 8
V
Continuous drain current
@ V
GS
= 4.5V; T
amb
=25°C (b)
I
D
4.3
A
@ V
GS
= 4.5V; T
amb
=70°C (b)
3.5
@ V
GS
= 4.5V; T
amb
=25°C (a)
3.5
Pulsed drain current (c)
I
DM
21
A
Continuous source current (body diode) (b)
I
S
2.4
A
Pulsed source current (body diode) (c)
I
SM
21
A
Power dissipation at T
amb
=25°C (a)
P
D
1
W
Linear derating factor
8
mW/°C
Power dissipation at T
amb
=25°C (b)
P
D
1.5
W
Linear derating factor
12
mW/°C
Operating and storage temperature range
T
j
, T
stg
-55 to +150
°C
Thermal resistance
Parameter
Symbol
Limit
Unit
Junction to ambient
R
⍜JA
125
°C/W
Junction to ambient
R
⍜JA
82
°C/W