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Diodes SDMG0340L /LA /LC /LS User Manual

Sdmg0340l /la /lc /ls, Features, Mechanical data

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SDMG0340L /LA /LC /LS


SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features

Low Forward Voltage Drop

Fast Switching

Ultra-Small Surface Mount Package

PN Junction Guard Ring for Transient and ESD Protection

Lead Free/RoHS Compliant (Note 3)

"Green" Device (Note 4 and 5)

Mechanical Data

Case: SOT-323

Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Solderable Per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe)

Terminal Connections: See Diagram

Marking Information: See Page 3

Ordering Information: See Page 3

Weight: 0.006 grams (approximate)

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SDMG0340L SDMG0340LA SDMG0340LC SDMG0340LS

Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

SDMG0340L /LA /LC /LS

Document number: DS30248 Rev. 12 - 2

1 of 4

www.diodes.com

July 2008

© Diodes Incorporated

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

V

RRM

V

RWM

V

R

40

V

RMS Reverse Voltage

V

R(RMS)

28

V

Forward Continuous Current (Note 1)

I

FM

30

mA

Non-Repetitive Peak Forward Surge Current

@ t = 8.3ms

I

FSM

200

mA

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 1)

P

D

200

mW

Thermal Resistance Junction to Ambient Air (Note 1)

R

θJA

625

°C/W

Operating and Storage Temperature Range

T

J,

T

STG

-40 to +125

°C

Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

Reverse Breakdown Voltage (Note 2)

V

(BR)R

40

V

I

R

= 10

μA

Forward Voltage

V

F

295

370

mV

I

F

= 1.0mA

Leakage Current (Note 2)

I

R

150

1000

nA

V

R

= 10V

Total Capacitance

C

T

2.0

pF

V

R

= 1V, f = 1.0MHz

Notes:

1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date
code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.









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