Diodes SDM10P45 User Manual
Sdm10p45, Features, Mechanical data
SDM10P45
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
•
Ultra-Small Surface Mount Package
•
Low Forward Voltage Drop
•
Fast Switching
•
PN Junction Guard Ring for Transient and ESD Protection
•
Lead Free/RoHS Compliant (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
•
"Green" Device (Notes 4 and 5)
Mechanical Data
•
Case: SOT-523
•
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
•
Polarity: See Diagram
•
Marking Information: See Page 2
•
Ordering Information: See Page 2
•
Weight: 0.002 grams (approximate)
Top View
Device Schematics
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
45
V
RMS Reverse Voltage
V
R(RMS)
40
V
Forward Continuous Current (Note 1)
I
FM
100
mA
Forward Surge Current
@ t < 8.3ms
I
FSM
1.0
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
P
D
120
mW
Thermal Resistance Junction to Ambient Air (Note 1)
R
θJA
833
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-40 to +125
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
V
(BR)R
45
⎯
⎯
⎯
I
R
= 100
μA
Forward Voltage
V
F
⎯
⎯
370
470
450
600
mV
I
F
= 10mA
I
F
= 50mA
Reverse Leakage Current (Note 2)
I
R
⎯
0.07
1.0
μA
V
R
= 10V
Total Capacitance
C
T
⎯
6.0
⎯
pF
V
R
= 10V, f = 1.0MHz
Notes:
1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
SDM10P45
Document number: DS30287 Rev. 12 - 2
1 of 3
www.diodes.com
July 2008
© Diodes Incorporated