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Diodes SD103ASDM User Manual

Sd103asdm, Features, Mechanical data

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SD103ASDM

Document number: DS30294 Rev. 9 - 2

1 of 3

www.diodes.com

July 2008

© Diodes Incorporated

SD103ASDM


SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY

Features

Low Forward Voltage Drop

Guard Ring Construction for Transient Protection

Fast Switching

Low Reverse Capacitance

Lead Free/RoHS Compliant (Note 3)

"Green" Device, (Note 4 and 5)

Mechanical Data

Case: SOT-26

Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Polarity: See Diagram

Leads: Solderable per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).

Marking Information: See Page 2

Ordering Information: See Page 2

Weight: 0.016 grams (approximate)









Top View

Device Schematic

Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

V

RRM

V

RWM

V

R

40

V

RMS Reverse Voltage

V

R(RMS)

28

V

Forward Continuous Current (Note 1)

I

FM

350

mA

Non-Repetitive Peak Forward Surge Current

@ t

≤ 1.0s

I

FSM

1.5

A

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 1)

P

D

225

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

R

θJA

444

°C/W

Operating and Storage Temperature Range

T

J

, T

STG

-65 to +125

°C

Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

Reverse Breakdown Voltage (Note 2)

V

(BR)R

40

V

I

R

= 100

μA

Forward Voltage Drop

V

F

0.37
0.50
0.60

V

I

F

= 20mA

I

F

= 100mA

I

F

= 200mA

Reverse Current (Note 2)

I

R

5.0

μA

V

R

= 30V

Total Capacitance

C

T

50

pF

V

R

= 0V, f = 1.0MHz

Reverse Recovery Time

t

rr

10

ns

I

F

= I

R

= 200mA,

I

rr

= 0.1 x I

R

, R

L

= 100

Ω

Notes: 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our

website at http://www.diodes.com/datasheets/ap02001.pdf.

2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.







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