Diodes SBR3U40P1 - Manual (Page 2)

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SBR3U40P1
Document number: DS31164 Rev. 10 - 2
2 of 5
www.diodes.com
October 2012
© Diodes Incorporated
SBR3U40P1
Maximum Ratings
(@T A = +25°C, unless otherwise specified.)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage V
RRM
V
RWM
V
RM
40 V
RMS Reverse Voltage V
R(RMS)
28 V
Average Rectified Output Current (See Figure 1) I O
3 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I
FSM
75 A
Thermal Characteristics
Characteristic Symbol Value Unit
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 5)
Thermal Resistance Junction to Ambient (Note 6)
Thermal Resistance Junction to Ambient (Note 7)
R θJS
R θJA
R θJA
5
175
100
ºC/W
Operating and Storage Temperature Range T
J
, T
STG
-65 to +150 ºC
Electrical Characteristics
(@T A = +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 8) V
(BR)R
40 - - V I
R
= 400
μA
Forward Voltage Drop V F
- 0.30 0.34
V
I
F
= 0.5A, T
J
= +25ºC
- 0.34 0.39 I F = 1.0A, T J = +25ºC
- 0.42 0.47 I
F
= 3.0A, T
J
= +25ºC
Leakage Current (Note 8) I
R
- 70 400 μA
V
R
= 40V, T
J
= +25ºC
- 8 40 mA V
R
= 40V, T
J
= +125ºC
Notes: 5. Theoretical R θJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
6. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com.
7. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com.
8. Short duration pulse test used to minimize self-heating effect.