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Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes SBR3M30P1 User Manual

Page 2: Sbr3m30p1

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SBR3M30P1

Document number: DS30641 Rev. 8 - 2

2 of 5

www.diodes.com

March 2012

© Diodes Incorporated

SBR3M30P1

SBR and POWERDI are registered trademarks of Diodes Incorporated.





Maximum Ratings

@T

A

= 25°C unless otherwise specified

Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.

Characteristic Symbol

Value

Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

V

RRM

V

RWM

V

RM

30 V

RMS Reverse Voltage

V

R(RMS)

21 V

Average Rectified Output Current (See Figure 1)

I

O

3.0 A

Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load

I

FSM

75 A

Non-Repetitive Avalanche Energy (Per Element)
(T

J

= 25ºC, I

AS

= 5A, L = 8.5mH)

E

AS

105 mJ

Repetitive Peak Avalanche Energy (Per Element)
(1

μs, 25ºC)

P

ARM

1100 W





Thermal Characteristics

Characteristic Symbol

Value

Unit

Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
Thermal Resistance Junction to Ambient (Note 5)

R

θJS

R

θJA

R

θJA

5

183
125

ºC/W

Operating and Storage Temperature Range

T

J

, T

STG

-65 to +175

ºC





Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

Reverse Breakdown Voltage (Note 6)

V

(BR)R

30 - - V

I

R

= 250µA

Forward Voltage Drop

V

F

-
-
-
-
-
-

0.26
0.37
0.46
0.16
0.29
0.42

0.30
0.41
0.50
0.19
0.32
0.45

V

I

F

= 0.1A, T

J

= 25ºC

I

F

= 1.0A, T

J

= 25ºC

I

F

= 3.0A, T

J

= 25ºC

I

F

= 0.1A, T

J

= 125ºC

I

F

= 1.0A, T

J

= 125ºC

I

F

= 3.0A, T

J

= 125ºC

Leakage Current (Note 6)

I

R

-

8.5

19

1.7
3.1

100
200

15
20

µA
µA

mA
mA

V

R

= 5V, T

J

= 25ºC

V

R

= 30V, T

J

= 25ºC

V

R

= 5V, T

J

= 125ºC

V

R

= 30V, T

J

= 125ºC

Notes:

3. Theoretical R

θJS

calculated from the top center of the die straight down to the PCB cathode tab solder junction.

4. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com.
5. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com.

6. Short duration pulse test used to minimize self-heating effect.