Diodes SBR2M30P1 - Manual

SBR2M30P1
2.0A SBR
®
SURFACE MOUNT SUPER BARRIER RECTIFIER
PowerDI
®
123
Features
• Ultra Low Leakage Current
• Excellent High Temperature Stability
•
Superior Reverse Avalanche Capability
•
Patented Interlocking Clip Design for High Surge Current
Capacity
•
Patented Super Barrier Rectifier Technology
• Soft, Fast Switching Capability
• 175ºC Operating Junction Temperature
•
±16KV ESD Protection (HBM, 3B)
•
±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
• Lead Free Finish, RoHS Compliant (Note 1)
• “Green” Molding Compound (No Br, Sb)
•
Qualified to AEC-Q 101 Standards for High Reliability
Mechanical Data
• Case: PowerDI ® 123
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
•
Polarity Indicator: Cathode Band
•
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 4
•
Ordering Information: See Page 4
•
Weight: 0.018 grams (approximate)
Top View
Maximum Ratings
@T A = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage V
RRM
V
RWM
V RM
30 V
RMS Reverse Voltage V
R(RMS)
21 V
Average Rectified Output Current (See Figure 1) I
O
2.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I FSM
75 A
Non-Repetitive Avalanche Energy
(T
J
= 25°C, I
AS
= 5A, L = 8.5 mH)
E
AS
105 mJ
Repetitive Peak Avalanche Energy
(1µs, 25°C)
P
ARM
1100 W
Thermal Characteristics
Characteristic Symbol Value Unit
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
R θJS
R θJA
R θJA
5
183
125
ºC/W
Operating and Storage Temperature Range T J , T STG
-65 to +175 ºC
Notes: 1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical R
ӨJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf
SBR and PowerDI are registered trademarks of Diodes Incorporated.
SBR2M30P1
Document number: DS30704 Rev. 7 - 2
1 of 4
www.diodes.com
October 2008
© Diodes Incorporated