3 special features, Special features -2, 1 product highlights – Asus P5K/EPU User Manual
Page 18
1-2
Chapter 1: Product Introduction
1.3
Special features
1.3.1
Product highlights
Intel
®
LGA775 Core™ 2 Processor Ready
This motherboard supports the latest Intel® Core™2 and Core™2 Quad
processors in LGA775 package. It also can support Intel® next generation 45nm
Multi-Core CPU. With new Intel® Core™ microarchitecture technology and 1333
/ 1066 / 800 MHz FSB, Intel® Core™2 processor is one of the most powerful and
energy efficient CPU in the world.
Intel
®
Core™2 Duo/ Intel
®
Core™2 Extreme CPU support
This motherboard supports the latest Intel
®
Core™2 processor in the LGA775
package. With the new Intel
®
Core™ microarchitecture technology and 1333 / 1066
/ 800 MHz FSB, the Intel
®
Core™2 is one of the most powerful and energy efficient
CPUs in the world.
Intel P35 Chipset
The Intel
®
P35 Express Chipset is the latest chipset designed to support 8GB of
dual-channel DDR2 1066 / 800/ 667 architecture, 1333/1066/800 FSB (Front Side
Bus), PCI Express x16 graphics and multi-core CPU. It especially includes Intel
®
Fast Memory Access technology that significantly optimizes the use of available
memory bandwidth and reduces the latency of the memory accesses.
Super Memspeed Technology
To attain top performance, ASUS has managed to break through current FSB
and DRAM ratio proportions by utilizing Super Memspeed Technology- the latest
technology that provides even more precise overclocking options to unleash
the true potential of DDR2 memory. Native DDR2 1066 maximizes system
performance by eliminating the bottleneck when overclocking both the CPU and
the memory- providing great performance for 3D graphics and other memory
demanding applications. Refer to page 2-13 for details.
Serial ATA 3 Gb/s technology
This motherboard supports the next-generation hard drives based on the Serial
ATA (SATA) 3Gb/s storage specification, delivering enhanced scalability and
doubling the bus bandwidth for high-speed data retrieval and saves. See pages
2-26 and 2-27 for details.