Asus P8H61-M PLUS V3 - Manual (Page 9)

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P8H61-M PLUS V3 specifications summary
(continued on the next page)
CPU LGA1155 socket for Intel ® 3rd/2nd Core™ i7 / i5 / i3 / Pentium ® /
Celeron ® processors
Supports 22nm / 32nm CPU
Supports Enhanced Intel ® SpeedStep Technology (EIST)
* Refer to www.asus.com for Intel ® CPU support list.
Chipset Intel ® H61 Express Chipset
Memory 2 x DIMM, max. 16GB**, DDR3 2200(O.C.) /2133(O.C.) /2000(O.
C.) /1866(O.C.) /1800(O.C.) /1600 /1333 /1066 MHz, non-ECC,
un-buffered memory
Dual-channel memory architecture
Supports Intel ® Extreme Memory Profile (XMP)
* 1600MHz and higher frequency is supported by Intel ® 3rd
generation processor.
** The maximum 16GB memory capacity can be supported with
8GB or above DIMMs. ASUS will update the memory QVL once
the DIMMs are available in the market.
*** Refer to www.asus.com for the latest Memory QVL (Qualified
Vendors List).
**** When you install a total memory of 4GB capacity or more,
Windows ® 32-bit operating system may only recognize less
than 3GB. We recommend a maximum of 3GB system memory
if you are using a Windows ® 32-bit operating system.
Expansion slots 1 x PCI Express 3.0/2.0 x16 slot
1 x PCI Express 2.0 x1 slots
2 x PCI slots
Storage Intel ® H61 Express Chipset:
- 4 x Serial ATA 3.0 Gb/s connectors
LAN
Realtek ® 8111E PCIe Gigabit LAN controller
Audio Realtek ® ALC887 8-channel* High Definition Audio CODEC
* Use a chassis with HD audio module in the front panel to
support an 8-channel audio output.
USB Intel ® H61 Express Chipset:
- 8 x USB 2.0/1.1 ports (4 ports at the mid-board, 4 ports at the
back panel)
ASUS unique
features
ASUS ESD Guard
ASUS GPU Boost
ASUS Anti-Surge Protection
ASUS UEFI BIOS
ASUS CrashFree BIOS 3
ASUS EZ Flash 2
ASUS MyLogo 2™
100% All High-quality Conductive Polymer Capacitors