Ironwood Electronics GigaSnap and BGA Surface Mount Foot soldering instructions - Manual (Page 4)

Page 4 of 4 BSI.doc, 2/17/09 Rev D
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Giga-snaP™ & BGA Surface Mount Foot Soldering Instructions (cont.)
Recommended Reflow Profile – High Temperature (RoHS)
(4) Surface tension between the adapter's solder spheres and the target PCB's pads will self-align
the part during the reflow process.
(5) Reflow:
• Use caution when profiling to insure minimal temperature difference (<15
0 C and preferably
<10
0
C) between components
• Forced convection reflow with nitrogen preferred (50 - 75 PPM)
• Preheat stage temperature ramp rate: <2
0
C per second
• Time required in Flux Activation stage: 120 seconds
• Flux Activation stage temperature range: 140 to 145
0
C
• Time required in Solder stage: 30-60 seconds
• Maximum temperature 230 - 249
0
C (Do not exceed 10 seconds at maximum temperature)
• Cool-Down stage temperature reduction rate: <2 0
C per second
NOTE:
It may be necessary to adjust the amount of heat when attaching the part, due to the fact that the
adapter mass is different from the actual IC package. Solder sphere spec = Sn96.5 Ag3.0 Cu0.5
and its melting point = 219
0 C
(6) Clean PCB with the flux manufacturers recommended process.