Ironwood Electronics GigaSnap and BGA Surface Mount Foot soldering instructions - Manual (Page 2)

Page 2 of 4 BSI.doc, 2/17/09 Rev D
Tel: (800) 404-0204 www.ironwoodelectronics.com
Giga-snaP™ & BGA Surface Mount Foot Soldering Instructions (cont.)
Soldering Reflow Profiles: Low Temp and High Temp (RoHS)
Note: Because there are many unknown variables for each customer’s situation, it is
difficult to recommend an ideal temperature profile for attaching an Ironwood adapter to
a particular customer’s target board.
A few of the unknowns which make a profile suggestion difficult:
1) The target PCB size, mass
2) Number and size of components next to the adapter target pattern
3) Reflow oven type
4) Type of solder paste/flux used
5) Solder stencil characteristics (thickness and aperture size)
Therefore, we offer the following profiles as a guide / reference to mounting our standard
and high temperature ROHS Giga-snaP™ and BGA SMT adapters.
While the following should work for most scenarios, Ironwood recommends contacting
your solder paste / flux manufacturer for proper reflow profiles for your particular set-up
and equipment.