Ironwood Electronics GigaSnap and BGA Surface Mount Foot soldering instructions - Manual (Page 3)

Page 3 of 4 BSI.doc, 2/17/09 Rev D
Tel: (800) 404-0204 www.ironwoodelectronics.com
Giga-snaP™ & BGA Surface Mount Foot Soldering Instructions (cont.)
(4) Surface tension between the adapter's solder spheres and the target PCB's pads will self-align
the part during the reflow process.
(5) Reflow:
• Use caution when profiling to insure minimal temperature difference (<15
0
C and preferably
<10 0 C) between components
• Forced convection reflow with nitrogen preferred (50 - 75 PPM)
• Preheat stage temperature ramp rate: <2
0 C per second
• Time required in Flux Activation stage: 150 to 180 seconds
• Flux Activation stage temperature range: 150 to 183
0 C
• Time required in Solder stage: 60 seconds
• Maximum temperature 210 - 220
0 C (Do not exceed 10 seconds at maximum temperature)
• Cool-Down stage temperature reduction rate: <2 0 C per second
NOTE:
It may be necessary to adjust the amount of heat when attaching the part, due to the fact that the
adapter mass is different from the actual IC package. Solder sphere spec = 63Sn, 37Pb and its
melting point = 183
0
C
(6) Clean PCB with the flux manufacturers recommended process.
Recommended Reflow Profile – Low Temperature
250
200
150
100
50
0
100 200 300 400 500
Preheat Flux Activation Reflow Cool-Down
<2°C
per Second
150 - 180 Seconds
<2°C
per Second
1° to 3°C
per Second
Time (seconds)
T
e
mper
atur
e
(°C)
Maximum Package Body Temperature
Solder Temperature Melting Point