Ironwood Electronics SBT User Manual - Manual (Page 11)

10 | P a g e S B T
. d o c , R e v . C , 6 / 2 8 / 2 0 1 2 , V P
Tel: (800) 404-0204
www.ironwoodelectronics.com

Repeated mechanical cleaning of the probe tips will shorten the time period between required
maintenance and more importantly it will start to remove surface plating which can result in continuity
issues as well as contact failures and increased resistance.

Heavy cleaning should be avoided if possible and if needed should only be performed once in the
lifetime of the test probes. Heavy cleaning can be done by using the same tools and methods as with
light cleaning with the exception of a soft brass brush being used with a very small amount of alcohol.
Remember that an excess of alcohol and heavy brushing can lead to damage as well as unfavorable test
results.
Wet Cleaning Procedure
Required equipment needed:

Soft to medium bristle nylon brush

Set of screwdrivers

Set of Hex / Allen wrenches

Small electronics industrial vacuum

Non-powdered latex or rubber gloves or finger cots

Ultrasonic bath

IPA 99.5%

Baking oven
Cleaning Procedure

Remove the socket from the load board and brush any debris from the solder pads of the load board
while vacuuming.

Remove 4 screws from the bottom of socket base. Slowly remove middle and bottom guide together
along with stamped contacts. Floating guide and floating springs will come apart. Save them for re-
assembly.

Separate both middle and bottom guides and dump stamped contacts into a beaker that has 99.5% IPA
(enough to cover the pins).

Place the beaker in ultrasonic cleaner and run at 22

C at frequencies approximately 40kHz.

Cleaning time: 45 to 60 minutes.

After the ultrasonic bath, remove the socket from the bath, and dry with 30 psi maximum compressed
air.

Bake socket for 30 minutes at 65C.
Reassemble procedure:

Flip the middle guide to side with bigger hole diameter and load SBT pins upside down with device
interface tip end going in first.

Align and place bottom guide on the top of the middle guide and flip the guide assembly.

Place the Compression springs in the pockets located on the middle pogo guide top side.

Align and place the top floating guide on top of the floating springs.

Align and press SBT guide assembly (3 guides) onto dowel pins protruding from socket base.

Mount 4 screws to attach SBT guide assembly to socket base.
Heat Sink Specifications
For high power dissipation, a specific heat sink lid can be designed using QFIN software. Please call Ironwood
Tech Support @1-800-404-0204.