Rainbow Electronics DS1647P - Manual (Page 10)

DS1647/DS1647P
10 of 11
DS1647 32-PIN PACKAGE
PKG 32-PIN
DIM MIN MAX
A IN.
MM
1.680
42.67 1.740
44.20
B IN.
MM
0.715
18.16 0.740
18.80
C IN.
MM
0.335
8.51
0.365
9.27
D IN.
MM
0.075
1.91
0.105
2.67
E IN.
MM
0.015
0.38
0.030
0.76
F IN.
MM
0.140
3.56
0.180
4.57
G IN.
MM
0.090
2.29
0.110
2.79
H IN.
MM
0.590
14.99 0.630
16.00
J IN.
MM
0.010
0.25
0.018
0.46
K IN.
MM
0.015
0.38
0.025
0.64
DS1647P
PKG INCHES
DIM MIN NOM MAX
A 0.920 0.925 0.930
B 0.980 0.985 0.990
C - - 0.080
D 0.052 0.055 0.058
E 0.048 0.050 0.052
F 0.015 0.020 0.025
G 0.025 0.027 0.030
NOTE:
For the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“live - bug”).
b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to
remove solder.