Rainbow Electronics DS1251Y - Manual (Page 20)

DS1251/DS1251P
20 of 22
DS1251P
PKG INCHES
DIM MIN NOM MAX
A 0.920 0.925 0.930
B 0.980 0.985 0.990
C - - 0.080
D 0.052 0.055 0.058
E 0.048 0.050 0.052
F 0.015 0.020 0.025
G 0.025 0.027 0.030
Note: Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“live-bug”).
Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than three
seconds.
To solder, apply flux to the pad, heat the lead frame pad, and apply solder. To remove the part, apply flux,
heat the lead frame pad until the solder reflows, and use a solder wick to remove solder.