Rainbow Electronics MAX5890 User Manual
Page 2
MAX5890
14-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= +3.3V, AV
DD1.8
= DV
DD1.8
= +1.8V, external reference V
REFIO
= +1.2V, output load 50
Ω double-ter-
minated, transformer-coupled output, I
OUT
= 20mA, T
A
= -40°C to +85°C, unless otherwise noted. Specifications at T
A
≥ +25°C are
guaranteed by production testing. Specifications at T
A
< +25°C are guaranteed by design and characterization. Typical values are at
T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AV
DD1.8
, DV
DD1.8
to AGND, DGND, DACREF,
and CGND.......................................................-0.3V to +2.16V
AV
DD3.3
, DV
DD3.3
, AV
CLK
to AGND, DGND,
DACREF, and CGND.........................................-0.3V to +3.9V
REFIO, FSADJ to AGND, DACREF,
DGND, and CGND ..........................-0.3V to (AV
DD3.3
+ 0.3V)
OUTP, OUTN to AGND, DGND, DACREF,
and CGND .......................................-1.2V to (AV
DD3.3
+ 0.3V)
CLKP, CLKN to AGND, DGND, DACREF,
and CGND..........................................-0.3V to (AV
CLK
+ 0.3V)
PD to AGND, DGND, DACREF,
and CGND.......................................-0.3V to (DV
DD3.3
+ 0.3V)
Digital Data Inputs (D0N–D13N, D0P–D13P) to AGND,
DGND, DACREF, and CGND ..........-0.3V to (DV
DD1.8
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C) (Note 1)
68-Pin QFN-EP (derate 28.6mW/°C above +70°C)....3333mW
Thermal Resistance
θ
JA
(Note 1) ....................................24°C/W
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................-60°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE
Resolution
14
Bits
Integral Nonlinearity
INL
Measured differentially
±1
LSB
Differential Nonlinearity
DNL
Measured differentially
±0.5
LSB
Offset Error
OS
-0.02
±0.001
+0.02
%FS
Full-Scale Gain Error
GE
FS
External reference
-4
±1
+4
%FS
Internal reference
±130
Gain-Drift Tempco
External reference
±100
ppm/
°C
Full-Scale Output Current
I
OUT
2
20
mA
Output Compliance
Single-ended
-1.0
+1.1
V
Output Resistance
R
OUT
1
M
Ω
Output Capacitance
C
OUT
5
pF
Output Leakage Current
PD = high, power-down mode
±1
µA
DYNAMIC PERFORMANCE
Maximum DAC Update Rate
600
Msps
Minimum DAC Update Rate
1
Msps
f
OUT
= 36MHz
A
FULL-SCALE
= -3.5dBm
-162
Noise Spectral Density
N
f
CLK
= 500MHz,
-12dBFS, 20MHz
offset from the
carrier
f
OUT
= 151MHz
A
FULL-SCALE
= -6.4dBm
-153
dBFS/Hz
f
OUT
= 36MHz
69
Signal-to-Noise Ratio Over
Nyquist
SNR
f
CLK
= 500MHz,
0dBFS
f
OUT
= 151MHz
64
dB
Note 1: Thermal resistance based on a multilayer board with 4x4 via array in exposed-paddle area.