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Bump description bump configuration – Rainbow Electronics MAX16074 User Manual

Page 5

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_______________________________________________________________________________________ 5

MAX16072/MAX16073/MAX16074

µP Supervisory Circuits in

4-Bump (1mm x 1mm) Chip-Scale Package

Bump Description

Bump Configuration

UCSP

( ) FOR THE MAX16073 ONLY

MAX16072

MAX16073

MAX16074

TOP VIEW

(BUMP SIDE DOWN)

1

2

B

A

+

GND

V

CC

MR

RESET/

(RESET)

BUMP

NAME

FUNCTION

MAX16072

MAX16073

MAX16074

A1

A1

A1

GND

Ground

B1

RESET

Active-Low Push-Pull Reset Output. RESET changes from high to
low when V

CC

drops below the detector threshold (V

TH

) or MR is

pulled low. RESET remains low for the reset timeout period after V

CC

exceeds V

TH

and MR is high. When MR is low, RESET is low.

B1

RESET

Active-High Push-Pull Reset Output. RESET changes from low to
high when V

CC

drops below the detector threshold (V

TH

) or MR is

pulled low. RESET remains high for the reset timeout period after V

CC

exceeds V

TH

and MR is high. When MR is low, RESET is high.

B1

RESET

Active-Low Open-Drain Reset Output. RESET changes from high-
impedance to active-low when V

CC

drops below the detector thresh-

old (V

TH

) or MR is pulled low. RESET remains low for the reset timeout

period after V

CC

exceeds the reset threshold and MR is high. When

MR is low, RESET is low.

A2

A2

A2

V

CC

Supply Voltage and Input for the Reset Threshold Monitor

B2

B2

B2

MR

Active-Low Manual-Reset Input. Drive low to force a reset. Reset
remains active as long as MR is low and for the reset timeout period (if
applicable) after MR is driven high. MR has an internal pullup resistor
connected to V

CC,

and may be left unconnected if not used.