Package information (continued) – Rainbow Electronics MAX8562 User Manual
Page 12
MAX8560/MAX8561/MAX8562
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in SOT and TDFN
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implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
6, 8, &10L, QFN THIN.EPS
PROPRIETARY INFORMATION
TITLE:
APPROVAL
DOCUMENT CONTROL NO.
REV.
2
1
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
21-0137
D
L
C
L
C
SEMICONDUCTOR
DALLAS
A2
A
PIN 1
INDEX
AREA
D
E
A1
D2
b
E2
[(N/2)-1] x e
REF.
e
k
1
N
1
L
e
L
A
L
PIN 1 ID
C0.35
DETAIL A
e
NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY
DOCUMENT CONTROL NO.
APPROVAL
TITLE:
PROPRIETARY INFORMATION
REV.
2
2
COMMON DIMENSIONS
SYMBOL
MIN.
MAX.
A
0.70
0.80
D
2.90
3.10
E
2.90
3.10
A1
0.00
0.05
L
0.20
0.40
PKG. CODE
6
N
T633-1
1.50–0.10
D2
2.30–0.10
E2
0.95 BSC
e
MO229 / WEEA
JEDEC SPEC
0.40–0.05
b
1.90 REF
[(N/2)-1] x e
1.50–0.10
MO229 / WEEC
1.95 REF
0.30–0.05
0.65 BSC
2.30–0.10
T833-1
8
PACKAGE VARIATIONS
21-0137
0.25–0.05
2.00 REF
MO229 / WEED-3
0.50 BSC
1.50–0.10
2.30–0.10
10
T1033-1
0.25 MIN.
k
A2
0.20 REF.
D
SEMICONDUCTOR
DALLAS
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,