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Vishay semiconductors, Thermal and mechanical specifications – C&H Technology VS-GB100TP120N User Manual

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VS-GB100TP120N

www.vishay.com

Vishay Semiconductors

Revision: 17-May-13

3

Document Number: 94821

For technical questions within your region:

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

Fig. 1 - IGBT Typical Output Characteristics

Fig. 2 - IGBT Typical Transfer Characteristics

Fig. 3 - IGBT Switching Loss vs. I

C

Fig. 4 - IGBT Switching Loss vs. R

g

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNITS

Operating junction temperature

T

J

-

-

150

°C

Storage temperature range

T

STG

- 40

-

125

Junction to case

IGBT (per 1/2 module)

R

thJC

-

-

0.19

K/W

Diode (per 1/2 module)

-

-

0.28

Case to sink

R

thCS

Conductive grease applied

-

0.05

-

Mounting torque

Power terminal screw: M5

2.5 to 5.0

Nm

Mounting screw: M6

3.0 to 5.0

Weight of module

150

g

200

175

150

125

100

75

50

25

0

0

0.5

1.5

1

2

2.5

3

V

CE

(V)

I

C

(A)

V

GE

= 15 V

25 °C

125 °C

200

175

150

125

100

75

50

25

0

5

6

8

7

9

10

11

12

13

V

GE

(V)

I

C

(A)

125 °C

V

CE

= 20 V

25 °C

I

C

(A)

E

on

, E

of

f

(mJ)

30

25

20

15

10

5

0

0

25

75

50

100

125

150

175

200

V

GE

= ± 15 V

T

J

=

125 °C

R

g

= 5.6

Ω

V

CC

= 600 V

E

on

E

off

R

g

(

Ω)

E

on

, E

of

f

(mJ)

30

25

40

35

20

15

10

5

0

0

10

30

20

40

50

60

V

GE

= ± 15 V

T

J

=

125 °C

I

C

= 100 A

V

CC

= 600 V

E

on

E

off