Renesas SH7050 Series - Manual (Page 16)

5
CAUTION
1. Never dip the IC socket in flux or use wash to clean the IC
socket. This is because flux may remain inside the IC
socket due to the IC socket’s structure. When using the
IC socket with other DIP products, never clean the other
DIP products with flux because the flux may enter the
connector through the guide pins of the IC socket.
2. When an IC socket with guide pins is soldered to the
user system, about 1.3 mm of the guide pins will stick out
(when the user-system board is 1.6 mm thick). When a
load is applied to the guide pins from the back of the
user-system board, stress will be applied to the soldered
part of the IC socket, and this may destroy the
connectors. Do not apply any load to the guide pins after
the IC socket has been soldered on the user system.
3. When an IC socket with no guide pins is soldered to the
user system, the soldered part will crack if stress is
applied to the IC socket. Therefore, always apply
adhesive to the connector and the user system so that
there is a firm connection between them.
4. When the IC socket has guide pins, it is recommended
that epoxy resin adhesive or solder be applied to the
guide pins at the back of the user system to make sure
that no stress is applied to the soldered part.